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Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials leads to the solder joints being subjected to cyclic (positive/negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue...
Solid-state lighting (SSL) products can have a predicted life of 70% lumen output (L70) from 26,000 to 40,000 hours using the LM-80-08 testing standards. Chromaticity shift, correlated color temperature (CCT) and lumen maintenance (LM) will dramatically reduce the nominal life of SSL luminaires. In this work, an off-the-shelf luminaire from Philips (AmbientLED) has been aged in a standard wet hot...
Wire bonding is predominant mode of interconnect in electronics packaging. Traditionally material used for wire bonding is gold. But industry is slowly replacing gold wire bond by copper-aluminum wire bond because of the lower cost and better mechanical properties than gold, such as high strength, high thermal conductivity etc. Numerous studies have been done to analyze failure mechanism of Cu-Al...
An investigation of a solid-state lighting (SSL) luminaire with the focus on the electronic driver which has been exposed to a standard wet hot temperature operating life (WHTOL) of 85% RH and 85°C in order to assess reliability of prolonged exposer to a harsh environment has been conducted. SSL luminaires are beginning introduced as headlamps in some of today's luxury automobiles and may also be...
Reliable, consistent, and comprehensive material property data are needed for microelectronics encapsulants for the purpose of mechanical design, reliability assessment, and process optimization of electronic packages. Since the vast majority of contemporary underfills are epoxy based, they have the propensity to absorb moisture, which can lead to undesirable changes in their mechanical and adhesion...
Due to aging phenomena, the microstructure, mechanical response, and failure behavior of lead free solder joints in electronic assemblies are constantly evolving when exposed to isothermal and/or thermal cycling environments. In our ongoing studies, we are exploring aging phenomena by nano-mechanical testing of SAC lead free solder joints extracted from PBGA assemblies. Using nanoindentation techniques,...
Electronics in automotive underhood applications may be subjected to temperatures in the neighborhood of 150°C to 175°C. Several of the electronics functions such as lane departure warning systems, collision avoidance systems are critical to vehicle operation. Prior studies have shown that low silver leadfree SnAgCu alloys exhibit pronounced deterioration in mechanical properties even after short...
The existing configuration of the JESD22-B111 test board does not impose identical strains during drop test on all the 15-components on the test board, requiring a large numbers of boards to develop meaningful life distributions. Two new candidate designs intended to serve as replacements for the JEDEC JESD22-B111 test board have been analyzed. Configuration-A includes four components located symmetrically...
Plastic encapsulated microelectronics (PEMs) has found wide spread applications in automotive environments for varied roles. Transition to hybrid electric vehicles and fully electric vehicles has increased the trend towards greater integration of electronics in automotive under hood environments. Electronics in such applications may be mounted directly on engine and on transmission. Electronics under...
In the electronic packaging industry, it is important to be able to make accurate predictions of board level solder joint reliability during thermal cycling exposures. The Anand viscoelastic constitutive model is often used to represent the material behavior of the solder in finite element simulations. This model is defined using nine material parameters, and the reliability prediction results are...
Micro-electro-mechanical systems (MEMS) devices are used in a variety of applications for sensing acceleration, translation, rotation, pressure and sound in addition to actuation and signal generation. The MEMS devices have been applied to varied fields including healthcare and automotive applications. Data on reliability degradation of MEMS devices in harsh environment applications including combined...
Industry migration to leadfree solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Sn-Ag-Cu family of alloys like SAC105 and SAC305. Electronics subjected to shock and vibration may experience strain rates of 1–100 per sec. Electronic product may often be exposed to high temperature during storage, operation and handling in...
A new method has been developed for assessment of the onset of degradation in solid state luminaires to classify failure mechanisms by using metrics beyond lumen degradation that are currently used for identification of failure. Luminous Flux output, Correlated Color Temperature Data on Philips LED Lamps has been gathered under 85°C/85%RH till lamp failure. The acquired data has been used in conjunction...
Solder materials in electronic packages are often subjected to thermal cycling, either during their application in products or during accelerated life qualification testing. Cyclic temperatures cause the solder joints to be subjected to cyclic mechanical stresses and strains due to the mismatches in the thermal expansion coefficients of the assembly materials. Such loads lead to thermomechanical fatigue...
Experimental testing and microstructural characterization have revealed that lead-free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. These changes are especially large in harsh environments, where the effects of aging on solder joint behavior must be accounted for and included in constitutive models when predicting...
In this work, aging phenomena in solder joints have been explored by nano-mechanical testing. Using nanoindentation techniques, the elastic, plastic, and creep behavior of SAC305 solder joint materials have been explored for various aging conditions. Single crystal solder joints were first extracted from PBGA assemblies (14 × 14 mm, 0.8 mm ball pitch, 0.46 mm ball diameter), and then subjected to...
Lead free solder materials are widely used in electronic packaging industry due to environmental concerns. However, experimental testing and microstructural characterization have revealed that Pb-free solders exhibit evolving properties that change significantly with environmental exposures such as isothermal aging and thermal cycling. These changes are especially large in harsh environments, where...
Leadfree solders have been used as interconnects in electronic packaging, due to its environmental friendly chemical property. However, those materials may experience high strain rates when subjected to shock and vibration. Consequently, failure will occur to electronics in those situations. Therefore, knowing the material properties of lead-free solders are extremely important, but research on mechanical...
Solid-state lighting (SSL) luminaires containing light emitting diodes (LEDs) have the potential of seeing excessive temperatures when being transported across country or being stored in non-climate controlled warehouses. They are also being used in outdoor applications in desert environments that see little or no humidity but will experience extremely high temperatures during the day. This makes...
In an effort to meet reliability requirements for long term human presence in space without the need for resupply, a new interconnect for grid array packages has been developed. The interconnect utilizes beryllium copper springs which are 0.05 inches in height as interconnects between the package and PCB. These novel interconnects are known as micro coil springs (MCS). The configuration is approximately...
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