The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
New and emerging applications in the consumer and mobile space, the growing impact of the Internet of Things (IoT) and wearable electronics (WE), and the slowdown of Moore's law have been driving many new trends and innovations in advanced packaging technology. The semiconductor industry now has to focus on integration and system scaling to meet the ever-increasing electronic system demands for performance...
The demand for wireless communications is increasing through use of smart phones, 3G handsets wherein high speed and reliable data communication are crucial requirements. Multi-bands networks help to facilitate these at higher range of radio frequencies. In many wireless communications, power amplifiers (PA) are used to increase the amplitude of relatively weak signals. These PAs depend on matching...
Demand for Wafer Level Package (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. WLP is the upcoming future packaging technology. The driving factors for the implementation of this packaging technology are the low packaging and test cost, the excellent electrical and thermal...
In this paper, inductors embedded in a mold material are characterized. Due to the low-loss property of the mold material, plated Cu inductors show high quality-factor (Q) performance. This performance is also better than those of similar inductors implemented from our IPD process. The mold material is not only used as a supporting substrate, but also served as package substrate, which allows the...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.