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With shrinking of chip sizes, Wafer Level Chip Scale Packaging (WLCSP) becomes an attractive and holistic packaging solutions with various advantages in comparison to conventional packages, such as Ball Grid Array (BGA) with flipchip or wirebonding. With the advancement of various fan-out (FO) WLPs, it has been proven to be a more optimal, low cost, integrated and reliable solution compared to fan-in...
To meet the continued demand for form factor reduction and functional integration of electronic devices, Wafer Level Packaging (WLP) is an attractive packaging solution with many advantages in comparison with standard Ball Grid Array (BGA) packages. The advancement of fan-out WLP has made it a more promising solution as compared with fan-in WLP, because it can offer greater flexibility in enabling...
With shrinking chip sizes, Wafer Level Packaging (WLP) is becoming an attractive packaging technology with many advantages in comparison to standard Ball Grid Array (BGA) packages. With the advancement of various fan-out Wafer Level Packaging (FOWLP) designs, this advanced technology has proven to be a more optimal and promising solution compared to fan-in WLP because of the greater design flexibility...
The trends for smartphone and other mobile devices are more than ever for integration and lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen in these devices. The implications of these market drivers on the packaging content of mobile devices including internet of things (IoT) and wearable...
The emergence and evolution of any package technology is driven by market trends as experienced by the end application. With the maturation of the mobile market, the trends for Smartphone and other mobile devices are more than ever for lower cost. Meanwhile, a higher degree of functionality and performance, thinner profile, and longer battery life are some of the additional market drivers seen in...
New and emerging applications in the consumer and mobile space, the growing impact of the Internet of Things (IoT) and wearable electronics (WE), and the slowdown of Moore's law have been driving many new trends and innovations in advanced packaging technology. The semiconductor industry now has to focus on integration and system scaling to meet the ever-increasing electronic system demands for performance...
The market for portable and mobile data access devices connected to a virtual cloud access point is exploding and driving both increased functional convergence as well as increased packaging complexity and sophistication. This is driving an unprecedented demand to increase the variety of wafer level, thin POP (Package on Package), and TSV (Through Silicon Via)/Interposer packaging solutions. It is...
Current portable electronic products are driving component packaging towards 3D packaging technologies for integrating multiple memory die and application processors (AP). Among the 3D technologies, Package-on-Package (PoP) is increasingly becoming mainstream due to its flexibility of combination and sourcing. Moreover, device designs require functional integration of IC's, especially in the 3rd dimension,...
The demand for wireless communications is increasing through use of smart phones, 3G handsets wherein high speed and reliable data communication are crucial requirements. Multi-bands networks help to facilitate these at higher range of radio frequencies. In many wireless communications, power amplifiers (PA) are used to increase the amplitude of relatively weak signals. These PAs depend on matching...
Demand for wafer level packaging (WLP) is being driven by the need to shrink package size and height, simplify the supply chain and provide a lower overall cost by using the infrastructure of a batch process. There are some restrictions in possible applications for Fan-In WLPs since global chip trends tend toward smaller chip areas with an increasing number of interconnects. The shrinkage of the pitches...
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