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Résumé We present a methodology for precise measurements and simulations of ESD system level stress applied to a simple printed circuit board. The impact of an external decoupling capacitance on the ESD propagation paths into an Integrated Circuit (IC) is demonstrated. Resulting current and voltage waveforms are analyzed to highlight the interactions between IC and components (including package, PCB...
Addressing system level ESD issues requires several types of technical know-how. A collaborative effort, bringing together a research laboratory, a semiconductor supplier and an Equipment Manufacturer (EM), has been initiated to study common and effective solutions to system level ESD problems. In this paper, a generic PCB for the ESD/EMC injection and measurement is presented.
In this paper, a behavioral modeling methodology to predict ElectroStatic-Discharge (ESD) failures at system level is proposed and validated. The proposed models enable time domain simulation to determine voltage and current waveforms inside and outside an IC during ESD events in order to predict the susceptibility of an electronic system to ESD. Very-high-speed integrated circuit Hardware Description...
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