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TSV or interconnect between chips have as a promising solution for overcoming interconnect and power bottlenecks in 3D IC. However, testing of 3D ICs remains a significant challenge, and breakthroughs in test technology are needed to make 3D integration commercially viable. This paper first presents an overview of TSV-related defects and the impact of TSVs in the form of new defects in devices and...
In modern SoCs embedded memories concentrate the majority of defects. In addition defect types are becoming more complex and diverse and may escape detection during fabrication test, leading to field failures due to the use of faulty components in final products. As a matter of fact memories have to be tested by test algorithms achieving very high fault coverage for a increasingly complex faults....
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