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We have demonstrated the front-gate (FG) III-V single structure CMOS using ultra-thin body (UTB) InAs/InGaSb on insulator (-OI) on Si substrates with high hole mobility (μeff) of 240 cm2V−1s−1. We have found that the μeff is enhanced by the buffered-HF (BHF)-cleaned InAs MOS interfaces, Ni alloy S/D, and the InAs/strained InGaSb-OI hetero-interface channel. The CMOS operation using FG InAs/InGaSb-OI...
We propose and demonstrate the operation of single structure III–V CMOS transistors by using metal S/D ultrathin body (UTB) InAs/GaSb-on-insulator (-OI) channels on Si wafers. It is found that the CMOS operation of the InAs/GaSb-OI channel is realized by using ultrathin InAs layers, because of the quantum confinement of the InAs channel and the tight gate control. The quantum well (QW) InAs/GaSb-OI...
CMOS utilizing high mobility III-V/Ge channels on Si substrates is expected to be one of key devices for high performance and low power advanced LSIs in the future. In addition, the heterogeneous integration of these materials with Si can provide a variety of More-than-Moore and Beyond CMOS applications, where various III-V/Ge functional devices can be co-integrated. In this presentation, we review...
Saturation of CMOS performance has been evident in the present 45/32 nm technology node, because of a variety of physical limitations on the miniaturization. Thus, channel engineering, including the enhancement of drive current due to high mobility channel materials and with robustness against short channel effects and characteristic variation due to multi-gate structures, has currently been recognized...
Ge photodetectors and Ge MOSFETs were integrated on Ge-on-Insulator substrate by using oxidation condensation technique. The responsivity of photodetectors up to 1575 nm and excellent switching of MOSFETs were demonstrated.
Mobility enhancement technologies have currently been recognized as mandatory for future scaled MOSFETs. In this paper, we review the basic concept on the choice of channel materials for high performance MOSFETs and address several important issues on carrier transport properties of mobility-enhanced CMOSFETs, including the effects of uniaxial strain on Si n-MOSFETs and the critical issues on Ge/III-V...
We have developed strained-Si-on-nothing (SSON) MOSFETs with a gate all around (GAA) structure by using selective wet etching and doped poly-Si CVD techniques. The nano-beam diffraction (NBD) method was employed to directly evaluate the strain within the SSON channels. We have demonstrated the enhanced drive current, Id, of the GAA SSON MOSFETs over that of relaxed control MOSFETs.
New short channel effects with nitride-oxide gate MOSFETs were found, where threshold voltage reduction occurs in a relatively long channel region. These effects would be explained by trapped charges or interface states induced by the mechanical stress at the Si and the nitride-oxide gate film in the course of the heat process.
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