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With more implementation of LED in lighting and communication applications, increasing demand for function enrichment and miniaturization has emerged. Existed technologies are highly challenged. System-in-package (SiP) technology is very promising in terms of function integration and cost reduction. In this paper, a novel SiP platform for LED system with integrated driver and wireless control function...
As the market demand of high power, high frequency and high efficiency, the advanced RF power packaging and assembly technology is facing the challenge of new material and new design. Improving the thermal conductivity of the heatsink (flange) is one of the effective ways to obtain low thermal resistance (Rth) component. Compared to the silicon transistors, the low-cost, high thermal conductivity...
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