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Wide band gap semiconductors have becomevery attractive for power electronics because of their excellentproperties at high power and high junction temperaturesabove 300°C. However, the maximum operation temperaturesof conventional packaging materials, like tin-based solders oreven tin-lead solders, are limited to around 220°C. Thus, a newpackaging material with a higher melting temperature must bedeveloped...
To avoid the use of high-lead-containing solders in electronics, new lead-free materials and bonding processes are desirable in the world and some solutions have explored for high-temperature applications. Recently, focusing on the use of nanoscale materials, the sintering behavior of nanoparticles has attracted interest as a high-temperature bonding processes. In this study, a feasibility study has...
With the miniaturization of electronic productions and the use of heat sensitive electronic components, the traditional reflow soldering process often has difficulties. As an alternative soldering process, the laser soldering process has been recently proposed. The laser soldering process brings several advantages in terms of localized heating, rapid rise and fall in temperature, non-contact and easily...
Electrically conductive adhesives (ECAs) have been investigated for the use in microelectronics packaging as a lead-free solder substrate. As metal filler in conductive adhesives, silver is the most commonly used due to its high conductivity and stability. However, the cost of conductive adhesives with silver fillers is much higher than conventional lead-free solders and silver has poor electro-migration...
As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity....
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