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This paper presents a new method for direct measurement of Mode-I stress intensify factor of cracks using Ba 0.64 Sr 0.36 TiO 3 flexoelectric strain gradient sensors. Firstly, strain gradient field around the opening mode crack tip was analyzed, followed by the derivation of induced flexoelectric polarization in the strain gradient sensors attached in the...
In this study, a coarse-grained model is developed to describe the interatomic interactions between a cross-linked epoxy and a copper substrate. Based on this model, the tensile deformation and failure of an epoxy/Cu bimaterial is studied. Attention is given to the microstructural evolution near the epoxy/Cu interface, and its effects on the overall stress-strain behavior of the bimaterial. It is...
Presented in this paper is a numerical study based on classical molecular dynamics simulation to understand the deformation and failure behavior of an epoxy/copper bimaterial under pure tension normal to the interface. The epoxy considered is a highly cross-linked epoxy phenol novolac, and the copper substrate is a standard face-center-cubic single crystal with its (1,1,1) surface as the epoxy/copper...
This paper reports the use of molecular dynamics simulations to study the thermomechanical properties of an epoxy molding compound formed by curing tri/tetra-functionalized EPN1180 with Bisphenol-A. An interactive crosslinking-relaxation methodology is developed to construct the simulation cell. This crosslinking-relaxation methodology allows the construction of highly crosslinked polymer network...
Epoxy molding compounds (EMC) have been widely used in electronic packaging industry as adhesives, for example, die-attach and underfill. However, interfaces between EMC and other components such as copper substrates are weak and prone to delamination, due to large interfacial stresses developed during thermal cycling processes. Cohesive zone finite element method is able to simulate fracture initiation...
A novel Epoxy Molding Compound (EMC) with a crosslinked network structure was formed by curing tri-/tetra-functionalized EPN1180 with Bisphenol-A. A full atomistic model reflecting the network nature of the material was constructed by applying an iterative crosslinking algorithm to an amorphous cell with 3D periodic boundary condition containing the stoichiometric mixture of constitutive monomers...
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