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With requirements of higher power density and smaller package size, thermal management of electronic packages has become increasingly challenging since last decade. With several design parameters playing an important role in evaluation of thermal characterization parameter, design approximations can lead to significant error. Substrate design is a critical aspect of the thermal model and the current...
The reliability of electrical components and their solder joints in particular, with respect to vibration, also often referred to as high cycle fatigue, becomes more and more important to customers in the automotive industry. The industry increasingly requires a guaranteed life time of the solder joints considering a defined vibration load by means of modeling and simulation due to shorter time to...
The thermal performance of electronic semiconductor components in automotive applications has always been one of the main challenges for electronic packaging. Interface or bulk fractures in the die attachment are failure modes that can have a significant impact on the thermal performance of the device. Especially for high power switching devices, the transient thermal performance is an important aspect...
This paper presents the application of mathematical model order reduction (MOR) methods to the automatic generation of dynamic component models that in turn are combined with each other to simulate a complete system. The latter is achieved by means of thermal ports in the component models that allow us to form a large interconnected system. The thermal ports are preserved from the physical structure...
This paper presents computational fracture analysis of the button shear test. The specimen under consideration is commonly used for the assessment of adhesion strength between encapsulating mold compounds and metal leadframes. The finite element method is applied for stress strain analysis of the shear test and for the extraction of fracture parameters for various crack configurations in the material...
Freescale's third-generation eXtreme Switch devices set performance standards for automotive lighting. They are tailored to drive high-intensity discharge (HID) xenon, halogen and light-emitting diode (LED) lamps. For example, a halogen lamp draws high levels of current when first turned on, but much less once it has stabilized. The ICs therefor allow the lamps to draw high levels of current when...
Higher pin count and reduced pitch along with increased wafer size set new demands to fine pitch wafer probe technology. Vertical buckling probe needles are one of the available concepts. The required elasticity for contacting the pad is achieved by buckling of the needles. The buckling mode guarantees a consistent contact pressure over a large range of overtravel and thus allows for an optimal tolerance...
Due to the demand of the industry for an increase of the number of I/Os, while decreasing the die size, the bond pads had to shrink and design restrictions for the active structures underneath had to fall. This leads to new challenges for the electrical probing and the mechanical robustness of the under-pad structures. This paper presents analytical and numerical simulation approaches for predicting...
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