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Scale formation is a longstanding and unresolved problem in a number of fields, including power production, petroleum exploration, thermal desalination, and construction. Herein, a high‐temperature scale‐resistant slippery lubricant‐induced surface (HTS‐SLIPS) is developed by one‐step electrodeposition and lubricant infusion. The fractal cauliflower‐like morphology with lubricant oil is conducive...
Scale Formation
Scale formation is a longstanding and unresolved problem in a number of areas. In article number 2203615, Steven Wang and co‐workers present a nature‐inspired high‐temperature scale‐resistant slippery lubricant‐induced surface (HTS‐SLIPS) showing excellent scale resistance under extreme conditions. It is anticipated that the simple and scalable coating fabrication approach will be...
This paper addresses the parameter identification of a batch bio-dissimilation process of glycerol to 1, 3-propanediol. Considering the least-square error criterion, the slop error criterion, and the sum of the least-square error criterion and slop error criterion of biomass, glycerol, 1, 3-propanediol, acetic acid and ethanol, respectively, three parameter identification models for the excess kinetics...
This study aimed to determine the impact of a ketogenic diet (KD) on neurobehavioral development when used to treat children with intractable epilepsy, confirming the efficacy of the KD, as well as the correlation between early electroencephalography (EEG) changes in the early stage with treatment efficacy.We enrolled 42 children who were starting treatment for intractable epilepsy with the classic...
Summary form only given. Fluorocarbon plasmas are widely used in Si and SiO2 etching. The generally accepted mechanism includes:1 a) ion activation of sites to produce a SiCxFy or SiO2CxFy complex layer, b) deposition of CxFy polymer layer on top of the complex and c) etching the complex by releasing volatile etch products, such as COFx and SiFx. Since the ion energies typically used in dielectric...
The development of plasma etching processes is challenged by the complexity of the chemistries and the unpredictability in the performance of plasma tools due to sometimes subtle changes in design. Challenges also face the use of modeling and simulation to provide a computational assist to the development of these processes. Selected issues in developing this modeling capability will be discussed.
Sawdust and modified peanut husk were used as adsorbents to remove Pb(II), Cr(III) and Cu(II) from aqueous solution. Results of kinetic experiments demonstrated that the adsorption was effective and rapid. Three different kinds of kinetic models (i.e., intraparticular diffusion model, Lagergren-first-order and second-order equations) were used to investigate the adsorption mechanisms. The adsorption...
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