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Some of the flaws in the interconnection wires of digital integrated circuits can be caused by fabrication defects or wear as the effect of electromigration effect. Interconnection wires add parasitic effects such as resistances and capacitances which contribute to the propagation delay of a logic gate signal to another. For long length wires the Elmore delay model for RC networks ladder, allows to...
Resistive opens in vias and interconnection lines have become an issue in modern nanometer technologies. These defects may produce small delays which are difficult to detect and may pose a reliability problem. In this paper, a statistical timing analysis framework is used to analyze the detectability of small delays due to resistive opens considering process variations. A statistical methodology to...
Resistive opens in vias and interconnection lines have become an issue in modern nanometer technologies. These defects may produce small delays which are difficult to detect and may pose a reliability problem. In this paper, a statistical timing analysis framework is used to analyze the detectability of small delays due to resistive opens considering process variations. A statistical methodology to...
Process variations have become a critical issue influencing the performance of nanometer digital circuits at gigascale integration; variations are classified in two types: inter-die and intra-die. Whereas inter-die variations affect the deviation of performance distribution in a lot of chips, intra-die variations affect the media of performance distribution. The present work proposes a new design...
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