The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Leading indicators of failure have been developed based on high-frequency characteristics, and system-transfer function derived from resistance spectroscopy measurements during shock and vibration. The technique is intended for condition monitoring in high reliability applications where the knowledge of impending failure is critical and the risks in terms of loss-of-functionality are too high to bear...
In this paper, a leading indicators based approach has been developed for prognostics and health monitoring of electronic systems. The approach focuses on the prefailure space and methodologies for quantification of damage progression and residual life in electronic equipment subjected to shock and vibration loads using the dynamic response of the electronic equipment. Traditional health monitoring...
Aerospace-electronic systems usually face a very harsh environment, requiring them to survive the high strain rates, e.g. during launch and re-entry and thermal environments including extreme low and high temperatures. Traditional health monitoring methodologies have relied on reactive methods of failure detection often providing little or no insight into the remaining useful life of the system. In...
In this paper, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, SnlAg0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented...
In this paper, a mathematical approach for interrogation of system state under cyclic thermomechanical stresses has been developed for three-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, Sn1Ag0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology...
In this paper, the feature extraction for health monitoring based on optical measurements of transient-strain from digital image correlation (DIC) in conjunction with ultra high-speed imaging has been investigated. Full-field measurement of transient strain have been made in various board assemblies subjected to shock in various orientations. Feature-extraction for health monitoring of leadfree area...
Electronic products may be subjected to shock and vibration during shipping, normal usage, and accidental drop. High strain rate transient bending produced by such loads may result in failure of fine pitch electronic interconnects. Current experimental techniques rely on electrical resistance for determination of failure. Significant advantage can be gained by prior knowledge of impending failure...
Methodologies for prognostication and health monitoring can significantly impact electronic reliability for applications in which even minimal risk of failure may be unbearable. Prognostics health-monitoring (PHM) approach presented in this paper is different from state-of-art diagnostics and resides in the pre-failure-space of the electronic-system, in which no macro-indicators such as cracks or...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.