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In this paper, a mathematical approach for interrogation of system state under cyclic thermo-mechanical stresses has been developed for 6-different leadfree solder alloy systems. Data has been collected for leading indicators of failure for alloy systems including, SnlAg0.5Cu, Sn3Ag0.5Cu, Sn4Ag0.5Cu second-level interconnects under the application of cyclic thermo-mechanical loads. Methodology presented...
This paper presents test results and specifications for SJ BISTTM, an innovative sensing method for detecting faults in solder-joint networks that belong to the I/O ports of field programmable gate arrays (FPGAs), especially in ball grid array packages. It is well-known that fractured solder joints typically maintain sufficient electrical contact to operate correctly for long periods of time. Subsequently...
Electronic products may be subjected to shock and vibration during shipping, normal usage, and accidental drop. High strain rate transient bending produced by such loads may result in failure of fine pitch electronic interconnects. Current experimental techniques rely on electrical resistance for determination of failure. Significant advantage can be gained by prior knowledge of impending failure...
Electronics may be subjected to shock, vibration, and drop-impact during shipping, handling and during normal usage. Measurement of transient dynamic deformation of the electronics assemblies during the shock and vibration can yield significant insights in understanding the occurrence of failure modes and the development of failure envelopes. Failure-modes include solder-joint failures, pad cratering,...
Product level assessment of drop and shock reliability relies heavily on experimental test methods. Prediction of drop and shock survivability is largely beyond the state-of-art. However, the use of experimental approach to test out every possible design variation, and identify the one that gives the maximum design margin is often not feasible because of product development cycle time and cost constraints...
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