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Designers of Microwave systems are constantly looking for DACs which provide not only Nyquist zones larger than 2.5 GHz but which also offer flat frequency response in these large instantaneous bandwidths, and in addition which also generate these signals with a centre frequency that is in the frequency band of interest. The component's performance can have strong implications in how microwave systems...
This paper provides an overview of the authors' research work to develop low-cost antennas and packaging technologies for 60GHz and 120GHz high speed data rate communications. First, a WiGig module designed in a low cost High-Density-Interconnect organic packaging technology is briefly depicted. The linearly polarized antennas integrated in a 12×12×0.5 mm3 ball-grid-array module exhibit a realized...
In this paper, we investigate the performance of a 3D-printed plastic lens operating in the 120 GHz frequency band. An Integrated Passive Device module with built-in linearly polarized patch antenna is used as the source of the lens. The profile of the lens is based on elliptical shape. It is first optimized with Geometrical Optics (GO) and Physical Optics (PO) methods. Then, full-wave simulations...
In this paper, we present several antenna-array topologies for quadrature spatial combining: In-phase and Quadrature signals are not anymore combined at the circuit level but rather spatially in free space. To demonstrate the feasibility of this concept, an organic module with two 4×1 antenna-arrays is fabricated and measured in V-band. Reflection coefficient and realized gain measurements are very...
MIMO antenna concepts for electronic eyewear devices operating in 4G cellular standard are proposed in this paper. Coupling element type antennas and matching circuits are used to obtain a high bandwidth potential for the coverage of the 700–960MHz and 1.7–2.7GHz frequency bands. To obtain a dual-antenna MIMO configuration, two CE type antennas are placed on the two sides of the head, resulting in...
In this paper, we compare the performance of micromachined Teflon and 3D printed Plastic lenses for WiGig modules. Both are based on extended hemispherical shapes. Reusing a HDI module with built-in antenna as a source, we demonstrate an antenna gain improvement of respectively 9 dB and 11 dB for the Plastic and the Teflon lenses. Full-wave simulations are verified by measurements.
A differential feeding technique for a broadband planar antenna-array is presented. The antenna structure is composed of four parallel linear series-fed arrays of four microstrip patches. To cancel the beam tilt versus frequency, one side of the array is fed with in-phase signal, whereas the same out-of-phase signal feeds the opposite side of the array. A rat-race balun is especially designed to generate...
A novel mobile terminal antenna covering the low LTE and GSM850/ 900 communication standards (i.e 700??960MHz) is proposed. The two-port antenna is composed of two coupling elements manufactured on a plastic piece using a laser direct structuring technique. To obtain a high port-to-port isolation between the two feeds, a neutralisation technique is applied. Simulated reflection coefficients and total...
This paper describes a tunable matching network, fully integrated in STMicroelectronics 130 nm CMOS SOI technology. It is able to correct, on the 2500–2690 MHz band, the antenna mismatch of a cellular phone due to the user interaction (for example the hand impact):any VSWR of 5:1 can be reduced to a value lower than 2:1.
During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS and advanced CMOS technologies. But for the 60 GHz market to flourish not only low cost RFICs are required, low cost antennas and packages are also key points. So far, HTCC technology has been seen as the chosen one when targeting millimeter wave (MMW) applications. But since...
In this paper, we present a new wideband miniature branchline coupler as a key element to be integrated for 60 GHz beamforming networks in phased arrays. Theory and equations as well as a first proof-of-concept at 2.2 GHz are presented. A 25% matching bandwidth (−10 dB), ± 1 dB amplitude imbalance and ± 2° phase imbalance are measured with a reduced footprint. Then, the same coupler topology is optimized...
A new dielectric resonator antenna (DRA) solution for the complete integration of radio front end at 60GHz is presented. The solution is a SoC configuration consisting of an integrated PA and a CPW fed slot on 65nm CMOS SOI (Silicon on Insulator) technology from ST Microelectronics. A co-design strategy is taken into consideration to reduce the size of the system and matching circuit losses. A total...
During past years, various research teams have been implied in the development of 60 GHz chipset solutions, using both BiCMOS or advanced CMOS technologies. But for the 60 GHz market to flourish, not only are low cost RFICs required, but also complete solution including the antenna. In order to address these issues, we review in this paper achievable antenna performance using High Resistivity (HR)...
This paper presents the design of a packaged antenna including glass substrate. A square patch antenna is implemented on glass substrate exploiting IPD™ technology, and excited by a coupling slot implemented on BiCMOS B9MW technology (Low Resistivity (LR) Si - ρ = 12 Ω.cm). The described solution solves the interconnection problem between Silicon Integrated Circuits (ICs) and the antenna. The excitation...
During past years, various research team have been implied in the development of 60GHz chipset solution, using both BiCMOS or advanced CMOS technologies. But for the 60GHz market to flourish, not only low cost RFICs are required, low cost antennas and packages also are. In order to address these issues, we review in this paper achievable antenna performance using High Resistivity (HR) silicon technologies,...
This paper presents a fully integrated 60GHz transceiver module in a 65nm CMOS technology for wireless high-definition video streaming. The CMOS chip is compatible with the WirelessHD™ standard, covers the four channels and supports 16-QAM OFDM signals including the analog baseband. The ESD-protected die (9.3mm2) is flip-chipped atop a High Temperature Cofired Ceramic (HTCC) substrate, which receives...
Since integration drives wireless business in order to achieve the appropriate cost and form factor, we see significant research concerning front end module (FEM) integration on silicon. In this quest, SOI technology has emerged as the technology of choice since the antenna switch and the power amplifier (PA) have been successfully integrated on SOI. In this paper, we will focus our investigation...
This work describes an UWB impulse transmitter with integrated antenna in the 60 GHz band implemented in CMOS65nm SOI technology. The transmitter aims low-power short-range high data-rate communication systems for fast-downloading applications. It consists of an oscillator that is switched on-and-off by the digital data to be transmitted and a medium power amplifier. The transmitter is fabricated...
This paper presents a broadband antenna on HR SOI CMOS technology for co-integration with power amplifier (PA) or low noise amplifier (LNA). In a System on Chip (SoC) approach, the co-design of the antenna and Integrated Circuits (ICs) on a same silicon substrate is a convenient solution to suppress lossy matching networks and to reduce the radio front-end cost. The proposed antenna presents a simulated...
A co-integrated Low Noise Amplifier (LNA) with a dipole antenna is designed considering a millimeter-wave dedicated BiCMOS technology. The targeted application is a 94 GHz passive imaging for security applications. The LNA is based on a high-speed SiGe:C 130 nm HBT. The interest of the co-integration on a common silicon substrate is demonstrated through the decrease of insertion losses between the...
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