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In order to make use of surplus heat resource and condense water in a plant, heat calculation was performed. Boiler feeding indirectly cooled waste steam, waste steam changed into condensation, the boiler feeding temperature raise about 100 centigrade, clean condensation was recycle and entered into boiler again. A novel method of waste steam recovery and condensed water reclamation was designed....
The rapid miniaturization of the electronic packaging accelerated the development of air cooling technology. In this research, both experimental and numerical methods are adopted to investigate the heat transfer between the air swirling impinging jets and an iso-heat-flux simulant chip. In the experiment scheme, the simulant chip is impacted by the swirling jet which is generated by inserting twisted...
Impinging jet is one of the ideal schemes to satisfy the heat dissipation requirement of the high power chips. In this research, experiments are carried out to investigate the heat transfer between the straight impinging jet array and an iso-heat-flux simulant chip (a heated epoxy resin plate). In the heat transfer experiments, two kinds of jet array are considered, the circular array and the four...
As the heat generation density of electronics packaging grow fast during recent years, the problem of heat dissipation of electronics become the obstruction of development of electronic packaging industry, which accelerated the research and development of heat transfer on the direction of microcosmic. In this research, an epoxy resin laminate heated by heating element was used as the heat transfer...
With much higher heat transfer rate than conventional heat transfer scheme, impinging jet received great attention from electronic heat engineers and some interested scholars. This kind of heat transfer scheme is of great possibility to become a practical solution to the cooling of high power density micro-electronics equipment. Although with simple boundary conditions, impinging jet is characterized...
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