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The advances of semiconductor technology are highly dependent on the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and nonconductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic selfcleaning lotus effect surfaces, etc. In...
Novel materials for embedded capacitor applications are in great demands, for which high dielectric constant (k), low dielectric loss and process compatibility with the printed circuit boards (PCBs) are the most important prerequisites. We have systematically investigated an efficient way to enhance the dielectric performance of the high-k nanocomposites by the selection of the appropriate filler,...
In this paper, a wide variety of high dielectric constant (k) composite materials which have been developed and evaluated for embedded capacitor application are reviewed. Current research efforts toward achieving high dielectric performance including high-k and low dielectric loss for polymer composites are presented. New insights into the effect of unique properties of the nanoparticle filler, filler...
Considerable attention has been devoted to the synthesis and application of nanoparticles because of their unusual physical and chemical properties resulted from the ultra-fine size and ultra-large surface area. Polymer composite materials based on metal nanoparticles provide a potential solution to meet the present and future technological demand in virtue of the good processibility and mechanical...
In-situ polymerization of aniline salt within epoxy matrices with various content of polyaniline (PANI) was successfully carried out to prepare PANI/epoxy composites. A flexible PANI/epoxy composite prepared in this fashion reached a high dielectric constant close to 3000, a dielectric loss less than 0.5 at room temperature and 10 kHz. The influence of PANI loading levels on various properties was...
In this study, we have developed high dielectric constant (k>50) embedded capacitor dielectrics with a moderate volume fraction of tiller that show good adhesion, good thermal stress reliability and good large area processibility at low processing temperature (<200degC). Material design and processing are critical to obtain a high dielectric constant composite at a moderate filler loading. The...
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