The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The 2003 ITRS roadmap identifies the need for peripheral I/O flip chip direct chip attach at 30mum pitch in 2007 and 20mum pitch in 2009. Area array flip chip packaging is expected to reach 90-100mum pitch in 2010. The drivers for such a reduction in pitch are two-fold: 1) higher I/O density on the IC due to the higher transistor density, and lower standoff height of 5-10mum, 2) interconnects to reduce...