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Nowadays, it exists path planning strategies dedicated to generate trajectories considering different navigation issues in UAV multirotors, such as 3D navigation in cluttered and uncluttered environments, obstacle avoidance, and path re-planning. Such path generators are mainly based on the dynamics associated to position and orientation of the UAV, and the attenuation of external disturbances as...
Thermal greases allow a low stress bond at low bond line thicknesses (BLT) at medium thermal conductivities and simple application, all of which make it an alternative to solders, thermal adhesives or pads. It is widely used in power and microprocessor applications, most of which involve large areas to be used for heat transfer. However, for years thermal overload failure of power modules and chips...
This contribution derives an efficient approach to model a coupled electro-thermal design problem for transient system simulation, using an analogue simulator, like SPICE. It introduces the electrical and thermal modelling procedures and the coupling of both models. The electrical model is based on the fundamental equations of semiconductor physics. Using the respective physical parameters the model...
Measuring or estimating adequately and accurately the state of charge (SoC) of a Li-Po battery, which powered an UAV during its flight allows to know the limits of the mission that the UAV is developing and to maximize the energy supplied by the battery. In this sense this paper presents a methodology to estimate the state of charge (SoC) of a Li- Po battery through an Extended Kalman Filter (EKF)...
New die attach technologies are necessary to meet the demand for faster and more reliable power electronic devices. Technologies based on sintering such as silver sintering and silver sinter adhesives are currently in the focus of technology development because of their high strength and very high thermal performance. To ensure the reliability of such a die attach reliable, fast and non-destructive...
This paper deals with the development of an innovative test stand for the measurement of thermal and electrical conductivity of metals, semiconductors, highly conductive die attaches and substrates using the steady state technique for thermal characterization and four-terminal sensing with pulse delta technique for electrical characterization. We present a systematic study of sintered silver in order...
The concentration of electronic and mechanical components on a PCB (e.g. a PC main board) continues to increase, leading to higher power densities and more stringent requirements for thermal management. In current and future air-cooled applications, in addition to conductive interaction, the consequences of natural and forced thermo-fluidic coupling must also be considered during the PCB layout process...
New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The socalled system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed. Transient thermal methods provide techniques...
This paper deals with the development und fabrication of a thermal test chip (TTC) to be used for thermal characterisation and qualification of materials and packages. The TTC is designed as a modular chip with the smallest full functional chip cell of 3.2mm × 3.2mm and consists of a heater structure and a temperature sensor. The chips can be applied in any required matrix. Heater and temperature...
New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The so-called system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed.
This paper introduces a miniaturized frictionless fan concept, which is similar to a piezo-electric driven fan principle. This type of fan has been employed for the enhancement of heat transfer by increasing the fluid circulation in regions which are otherwise stagnant.
New packaging technologies are necessary to meet the demand for smaller and more reliable electronic devices. The so-called system-in-package (SiP) concept brings different technologies, material combinations and processes together in one package. To ensure the reliability of such a package reliable, fast and non-destructive failure analysis are needed.
This paper deals with the system design, technology and test of a novel concept of integrating Si and SiC power dies along with thermo-electric coolers in order to thermally manage transients occurring during operation, thus turning it into a smart power device. The concept features double-sided cooling as well as new materials and joining technologies to integrate the dies such as transient liquid...
Thermal interface materials (TIMs) are widely needed to improve thermal contacts for facilitation heat transfer in electronic packaging, such as that associated with the flow of heat from microprocessor to a heat spreader or a heat sink in a computer. Due to thermal mismatch between these components mechanical strain occur which cause pump-out, cracks or delamination of TIM. In order to qualify the...
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods have to keep up with the pace of this development with respect to resolution and accuracy. We have developed both bulk and interface technologies to...
Nowadays very often IR-thermography is used to analyze the temperature on electronic device surfaces. To measure the absolute surface temperature correctly, the IR-camera detector has to be calibrated with a corresponding evaluation software using a black body calibration device. Commercially available black radiators are heavyweight and a calibration of macrolenses is not possible due to mismatch...
The ongoing need for miniaturization and speed in electronics industry has brought a requirement for better performing thermal management systems. One of the major bottlenecks in thermal management is the thermal interface resistance. Characterisation of thermal interface materials become even tougher a challenge at low bond line thicknesses and higher thermal conductivities of the interface materials...
Nowadays very often IR-thermography is used to analyze the temperature on electronic device surfaces. To measure the absolute surface temperature correctly, the IR-camera detector has to be calibrated with an corresponding evaluation software using a black body calibration device. Commercially available black radiators are heavyweight and a calibration of macro-lenses is not possible due to mismatch...
As the demand for new thermal technologies and materials has been increasing over the years to provide thermal solutions to the next generation of power electronics, microprocessors and high-power optical systems also thermal characterisation methods have to keep up with the pace of this development with respect to resolution and accuracy. Within the EU-funded project ldquoNanopackrdquo we have developed...
Taking the advantage of the thermo-elastic effect, while using an infrared camera system, the mechanical stress could be made visible. The stress concentrations at the tip of a subcritical crack growth could clearly be detected. Through the observation during the periodic loading of a CT-specimen the crack growth rate can be determined. For this purpose, a specially developed loading stage will be...
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