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The emergence of fan-out packaging for 5G and IoT applications has brought escalating performance concerns that arise from the proximity of radiating components such as antennas to lossy materials such as metals and silicon. These concerns also arise in wearable (“smart skin”) electronics where the human tissues act as the lossy substrate. Artificial magnetic conductors (AMC) are widely explored for...
Double-sided 3D glass interposers and packages, with through package vias (TPV) at the same pitch as TSVs in Si, have been proposed to achieve high bandwidth between logic and memory with benefits in cost, process complexity, testability and thermal over 3D IC stacks with TSV. However, such a 3D interposer introduces power distribution network (PDN) challenges due to increased power delivery path...
This paper presents a new active and passive integration concept called 3D IPAC (Integrated Actives and Passives) to address the power integrity in high-performance and multifunctional systems. The 3D IPAC consists of an ultra-thin glass module with through-vias and double-side integration of ultra-thin active and passive components to form functional modules. By integrating power ICs, storage capacitors...
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