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In this work, a low noise figure, high linearity cross-coupled negative feedback common gate (CG) low noise amplifier (LNA) in 1.2 V, 65 nm CMOS technology with a unique output conductance optimization method is proposed. Traditionally, CG-LNAs are known for their good linearity at the cost of a poor noise figure, making them limited to few applications where high linearity is the primary goal. The...
Ultrathin 3-D glass interposers with through-package vias at the same pitch as through-silicon vias (TSVs) have been proposed as a simpler and cheaper alternative to the direct 3-D stacking of logic and memory devices. Such 3-D interposers provide wide-I/O channels for high signal bandwidth (BW) between the logic device on one side of the interposer and memory stack on the other side, without the...
2.5D integration based on interposer technologies provides high density integration and high system bandwidth. Among many materials for the interposer substrate, glass could be a promising material since it provides low signal loss and its ultra-thin thickness. When chips are stacked on the glass interposer, power distribution network impedance of 2.5D IC must be estimated, analyzed and optimized...
Double-sided 3D glass interposers and packages, with through package vias (TPV) at the same pitch as TSVs in Si, have been proposed to achieve high bandwidth between logic and memory with benefits in cost, process complexity, testability and thermal over 3D IC stacks with TSV. However, such a 3D interposer introduces power distribution network (PDN) challenges due to increased power delivery path...
This paper presents a new active and passive integration concept called 3D IPAC (Integrated Actives and Passives) to address the power integrity in high-performance and multifunctional systems. The 3D IPAC consists of an ultra-thin glass module with through-vias and double-side integration of ultra-thin active and passive components to form functional modules. By integrating power ICs, storage capacitors...
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