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In this paper, different type of wax, wax content and hot hardness at 175°C on the release force and adhesion of molding compound were studied, The studies reveal that the hot hardness is playing a very important role to balance the conflict of reliability and moldability. With higher hot hardness of epoxy molding compound, the release force can be kept at same level with less wax content which can...
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
With the rapid development of the semiconductor filed, more and more challenges have been put forward to the packaging materials as well. Epoxy molding compound (EMC) as one the most important packaging material with the monopoly position was required for low water absorption, high adhesion, and low internal stress and so on. Here, adhesion improvement has been investigated through introducing special...
With the rapid development of the semiconductor filed, more and more advanced package types have turned up such as Quad Flat No-lead (QFN), Ball Grill Array (BGA), and so on to meet the requirement of the high O/I function. Followed on, warpage has emerged as a big challenge during cutting and surface mounting process. As packing material, Epoxy molding compound (EMC) often show different performance...
The delamination of epoxy molding compound (EMC) on T0252 after JEDEC level 3 and 260c reflow was studied from 3 factors as epoxy resin, phenol hardeners, and filler content. It indicated that when the epoxy resin is mixed of biphenyl and EOCN type, phenol resin is the new type with the structure as Fig.l, filler content as 84%, the resulting epoxy molding compound exhibited the same performance as...
Thermal stability and color change of carnauba wax, ester wax, OP wax, S wax, stearic acid, GMS and a few polyethylene wax types were investigated by heating them to a specific temperature 175C for about 50hours. Cluster analysis was adopted by analyzing the weight loss of the wax. Based on the weight loss data, these wax can be divided into three groups, the most stable group which includes carnauba...
The effects of filler loading, types of rubber (elastomer) and glass transition temperature (Tg) on mold compound's toughness at room and high temperature (240°C) were investigated. The new simplified toughness test method based on ASTMD5049 was also developed. The study was done with L39 Taguchi method, 3 factors with 3 levels. The factors are filler percentage (88%,89% and 90%,) Tg value (defined...
This paper is to study the warpage impact of filler content and special additives on BGA packages. The special additives have significant impact on the warpage. The additive A has great influence on the warpage at different temperature; the warpage will flatten when more additive A is added. From the warpage study of single unit from room temperature to 260degC, all the warpage is in 50um when additive...
Surface chemistry and surface energy of copper leadframe after thermal treatment at 175C were studied by XPS and contact angle. The adhesion after JEDEC level 3 and reflow between epoxy molding compound and leadframe after thermal treatment was measured too. The results shows that the adhesion between epoxy molding compound and heated lead frame increased with heat the leadframe up to 3 minutes then...
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