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In this study, high brightness LED package is considered. Steady state heat transfer process analysis is firstly carried out using 3-D finite element method. Temperature distribution and thermal resistance of the package are then determined. The FEM results are evaluated by thermal resistance measurement on the package by T3STer system. In addition design study on the thermal performance of the packaging...
Numerical experiments based on the three-dimensional (3D) nonlinear finite element method (FEM) has been conducted to understand governing damage mechanisms during the die attachment for the ball grid array (BGA) packages. The parametric studies for various designs of the BGA package and material properties have been performed. A wide range of the modulus (1MPa~30GPa) and the coefficient of thermal...
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