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A thermal bonding based wafer transfer technology was developed and successfully applied to integrate RF MEMS switch and CMOS ICs on an organic substrate. The major process modules and challenges in this transfer technology are discussed. By integrated together on the new substrate, the RF-MEMS switch illustrates significantly improved performance, and the CMOS show preserved functionality. This technology...
A novel monolithic integration of RF MEMS switch and CMOS IC on organic substrate was demonstrated. RF MEMS switch was firstly fabricated on CMOS IC wafer, and the stacked structure was subsequently transferred onto an organic substrate (i.e., FR-4). The RF-MEMS switch illustrates significantly improved performance, while integrated together, the CMOS show preserved functionality. This technology...
A thermal bonding based wafer-transfer-technology (WTT) has been developed and successfully applied to transfer active devices, RF-passive components and high density interconnect pre-fabricated by CMOS technology onto a flexible organic substrate. The intrinsic performances of transistors and interconnect are preserved with excellent reliability, and the RF-passive components are clearly demonstrated...
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