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We presented a 32-channel silicon hybrid demultiplexer fabricated with CMOS technology. Double-etched mode converter and wide arrayed waveguide are used to improve AWG performances while the counter-tapered coupler is optimized for broadband mode multiplexing.
Piezoelectric micromachined ultrasonic transducer (pMUT) gains increasing interests from researchers. It overcomes the inherent shortcomings of conventional bulk ultrasonic transducers such as acoustic impedance mismatching. In addition, pMUT does not require the extremely large input voltage as capacitive micromachined ultrasonic transducer (cMUT), which is potential to be integrated into portable...
We demonstrate a silicon QPSK modulator consisting of two nested Mach-Zehnder interferometers with 3.5 mm long traveling-wave electrodes. 64 Gb/s QPSK modulation is achieved with an EVM of 24.4% and power consumption of 7.1 pJ/bit.
We experimentally demonstrate the use of simple MEMS microcantilevers as an efficient way to achieve dynamic manipulation of terahertz waves. An array of subwavelength sized microcantilevers acts as metamaterial, which can be electrostatically tuned to provide active control of light-matter interaction. The proposed metamaterial shows tuning range of 0.3 THz, which is further improved to 0.36 THz,...
The requirement of integrating a large number of heterogeneous cyber and physical entities in cyber-physical systems (CPSs) motivates the use of a service-oriented architecture (SOA), which can support the composition of two or more available functionalities to form a complex service. This paper presents a context-sensitive service composition framework in CPS with dependability requirements. Firstly,...
This paper addresses an energy-efficiency (EE) maximized resource allocation (RA) problem for cooperative orthogonal frequency division modulation (OFDM) transmission, when the system's total power consumption (including the circuit power and transmission power) is limited below a peak value. The improved DF relaying protocol proposed in [1] is used with optimized subcarrier pairing. The EE is evaluated...
This paper presents the first demonstration of a high-throughput die-to-panel assembly technology to form Cu interconnections without solder at temperatures below 200°C. This interconnection technology, previously established with individual single-chip packages on both organic and glass substrates, at pitches down to 30μm, is brought up to a significant manufacturable level by two major innovations:...
A NEMS piezoresistive pressure sensor with annular grooves on the circular diaphragm is presented here. Silicon Nanowires (SiNWs) are embedded as sensing elements at the edge of the diaphragm. This new diaphragm structure improves the device sensitivity by 2.5 times under a low pressure range of 0∼120 mmHg with respect to our previously reported flat diaphragm pressure sensor. With the advantage of...
We demonstrate a single-drive high-speed silicon Mach-Zehnder modulator with the Vπ·L of 1.35 V·cm. 20 Gb/s on-off keying (OOK) and 15 Gb/s binary phase shift keying (BPSK) modulations are achieved.
In this paper, we present a novel real-time velocity estimation algorithm. A sensor assembly consisting of a monocular camera and an inertial measurement unit with three-axis accelerotmeter and gyroscope is considered. To improve the robustness of the velocity estimator with respective to image noise, we apply a coarse-to-fine structure based on multiple feature correspondences over three consecutive...
Various Nanoelectromechanical Systems (NEMS) sensors using piezoresistive silicon nanowires (SiNWs) as the sensing elements for pressure, strain and flow detection are reported. Measurement results reveal both excellent scalability and sensing stability for SiNWs based NEMS devices. Additionally, the new ultracompact pressure sensor with novel micro-grooved diaphragm structure is reported for low...
This paper presents the first demonstration of polycrystalline silicon interposers with fine pitch through package vias (TPV), with less than 5μm RDL lithography at 50μm pitch copper microbump assembly. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration; however, they are limited by high cost and high...
3D Integration is a good solution for extending Moore's momentum in the next decennium. Through Silicon Via (TSV) is an alternative interconnect technology for higher performance system integration with vertical stacking of chips in package. Due to high demands of chip miniaturization, small diameter TSV with high aspect ratio has become particularly important. This paper focuses on Cu electroplating...
Copper chemical mechanical polishing (CMP) and wafer thinning technologies have been challenges for Through Silicon Via (TSV) interconnect in recent years. In this work, copper CMP slurry and process and wafer level thinning with temporary bonding were studied in detail. The concentration of peroxide (H2O2), citric acid, SiO2 particle and Benzotriazole (BTA) in the CMP slurry and their effects were...
The sensor is a multi-board system composed of backboard and other plugging boards. It is a crucial problem that how to assure the signal integrity (SI) for such a complex system. In this paper, we mainly discuss the various signal integrity plots of critical signals in digital circuit board and EMC problems in the multi-board sensor system. The SI and EMC conditions can be improved with the help...
Nowadays, three-dimensional (3D) integration has been widely applied in semiconductor and electronics industry. When 3D integration applied in MEMS (micro electromechanical system) packaging, it is possible to stack host MEMS chip/wafer with other chips/wafers (such as ASIC) to lower package profile and realize area array sensor system. In this paper, a miniaturized piezoresistive pressure sensor...
Conventional vascular interventional surgery (VIS) is performed under fluoroscopic guidance by surgeons. In order to reduce X-ray irradiation to the interventional radiologists, catheter operating systems have been developed to assist surgeons. This paper proposed an active supporting medical manipulator, which can neatly adjust and accurately position the catheter operating system. Forward kinematics...
A simple top down method to fabricate an array of vertically stacked nanowires is presented. By taking advantage of the non-uniformity of the Inductive Coupled Plasma (ICP) etching process to form a scalloped sidewall followed by a subsequent stress limited oxidation step, a narrow silicon fin can be vertically patterned to form stacked nanowires with different cross-sectional shapes. The stacked...
For the current open, dynamic and ever-changing Internet environment, select the security, integrity, trusted, software coordination entity with reliable quality of service has great difficulty, Internetware service entity is difficult to ensure the other's trusted in mutual coordination. Trusted relationship between software entities for the trust of Internetware has important significance. This...
A detecting system aiming to Light Addressable Potentiometric Sensors is proposed. By means of this system not only the sensitive signal data can been measured and stored real time, but also the system configuration can be set and query via the friendly User Interface. History data can be reviewed conveniently using database technology.
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