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Sintered silver has received a great deal of recent attention as a high-temperature die-attach material. A detailed study of the sintered silver for bonding insulated gate bipolar transistor dies is reported. The purpose was to compare the reliability between sintered silver and Sn-3Ag-0.5Cu (SAC305) solder joints. It was found that the sintered silver had a porous and crack-free structure. And compared...
We report the effects of multiple reflow cycles on the reliability of Sn-Sb solders. Reflow soldering technology was used to prepare the Sn-Sb joints after 1 reflow cycle, 2 reflow cycles and 3 reflow cycles. We found that the intermetallic compound layers became thicker and denser with the reflow cycle increased. And the samples here had good bonding quality with only a few voids. After 600 thermal...
An electromagnetic transient simulation model of 500 kV HVDC Power Networks in Hubei province is established. According to the actual configuration and parameters, all the primary electrical devices in 500 kV AC/DC hybrid power grids are modeled in detail, including HVDC converter, AC/DC transformers, AC/DC breakers, filters, reactors, transmission lines, grounding polar, and all the other power elements...
A system reliability analysis method based on system functional model is presented for the limitations of existing reliability modeling and assessment methods which have difficulties in reliability modeling, especially for complex systems. System function failure model is established firstly, and then the minimum cut sets are obtained through the fault simulation. System task reliability can be calculated...
Traditional reliability model, which is based on fault state logic of product composition units, has inherent limitations, e.g., it can't map the failure caused by cumulative error of performance degradation or parameter drift, and can't associate reliability requirements or product failure time with product design parameters so that little use is got to support testability or PHM function design,...
This paper proposes a novel risk evaluation system for HVDC planned maintenance using probabilistic method. A quantitative evaluation method is put forward to measure how HVDC system maintenance affects power system reliability. Two major indexes, which are loss of load probability (LOLP) and Security Index (SI), are chosen to construct the power grid operation risk indexes. Based on the calculation...
This paper reports the first design and demonstration of a manufacturable 20 μm pitch Cu interconnection technology to ultra-thin glass interposers. Bonding is accomplished at temperatures below 200 °C without the need for solders. Manufacturability challenges such as substrate warpage, bump noncoplanarity and assembly throughput with low bonding times are addressed with this technology. The modeling...
This paper presents the first demonstration of polycrystalline silicon interposers with fine pitch through package vias (TPV), with less than 5μm RDL lithography at 50μm pitch copper microbump assembly. Silicon interposers with through silicon vias (TSV) and back end of line (BEOL) wiring offer compelling benefits for 2.5D and 3D system integration; however, they are limited by high cost and high...
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