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Presented in this paper is a feasibility study of a chip stacking technology for very high bandwidth communication. This technology utilizes transmission line coupling between coplanar differential lines constructed in metal layers of two chips placed facing each other such that the differential pairs are overlapped with a spacing of many microns. In previous study we demonstrated communication at...
Presented in this paper is a new chip stacking technology for very high bandwidth communication. This technology utilizes transmission line coupling between two differential pairs in the metal layers of the stacked LSI chips. We have demonstrated communication at 12.5 GHz between two differential pairs of transmission lines fabricated on different metal layers in a single chip. This technology is...
In this paper, we introduce a very high bandwidth proximity communication technique for Stacked LSIs. This technology is based on transmission line coupling between two differential pairs in the metal layers of each chip and can be implemented without modifying conventional chip fabrication process. We have demonstrated its feasibility using a single chip in which coupled two differential pairs of...
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