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We have investigated the electrical properties of anisotropic conductive adhesive (ACA) joint using submicrometer-sized (~500 nm in diameter) silver (Ag) particle as conductive filler with the effect of π-conjugated self-assembled molecular wires. The ACAs with submicrometer-sized Ag particles have higher current carrying capability (~3400 mA) than those with micro-sized Au-coated polymer particles...
Abstract form only given. Lead, a major component in solder, has long been recognized as a health threat to human beings. One of the proposed lead-free candidates is electrically conductive adhesives (EGAs), which are composed of polymer matrix and conductive fillers. Usually epoxy and silver flakes are used as the polymer matrix and conductive fillers, respectively. Recently, Ag nanoparticles were...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch...
Silver migration has long been one of the most critical issues in semiconductor electronic industry, while no effective approaches have been developed to control silver migration and maintain its excellent electrical and thermal properties. In this paper, we report a novel approach of using molecular self-assembled monolayers (SAMs) to dramatically reduce silver migration in the nano-Ag conductive...
Electrical properties of the isotropic conductive adhesives filled with micron sized silver flakes and nanosized silver particles were investigated. By using appropriate surfactants, the resistivity of the silver flakes and silver nanoparticles incorporated conductive adhesives was dramatically reduced to as low as 5 times 10-6 Omega.cm. Morphology studies showed that the decreased resistivity resulted...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests in electronic packaging industry due to the advantages of ultra fine pitch capability potential (pitch <20 mum due to the availability of micro-sized conductive particles), low processing temperatures, low stress on substrate, environmentally friendly, etc. In this study, effects of nano silver (Ag) particles...
Different types of self-assembled monolayers (SAMs) were used to treat nano Ag fillers. Self-assembled monolayer (SAM) molecules wires can act as electrical junctions between the conductive filler of the ACA and the contact pad of the substrate, as such, the interfaces between the conductive fillers and contact pad could be enhanced. Thermogravimetric analyzer (TGA), differential scanning calorimeter...
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