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A Hetero Acoustic Layer (HAL) SAW device is a new type of SAW device with a solidly mounted monocrystalline piezoelectric thin plate, which can obtain very high impedance ratio (ZR) and small temperature coefficient of frequency (TCF) at the same time. In this study, HAL SAW resonators using a LiTaO3 (LT) thin plate and a quartz substrate were investigated numerically and experimentally. The resonator...
For mobile communication, acoustic wave filters are being continuously required better steepness of a passband and a smaller temperature coefficient of frequency (TCF). Recently, various Hetero Acoustic Layer (HAL) types of surface acoustic wave (SAW) devices were reported by different groups including us [1-5]. HAL SAW devices inherently have many variations of structure and a lot of potentials....
Surface acoustic wave (SAW) resonators with a moderate bandwidth and a large impedance ratio are obtained by Hetero Acoustic Layer (HAL) structure combing a LiTaO3 (LT) thin plate and the substrate, which has a high velocity of leaky SAW and a small frequency temperature coefficient (TCF). In this study, a new type of HAL SAW resonators were fabricated using 0.5-1 μm thick 42oYX or 20oYX LT and 42...
A mobile immunoassay system which carries out all its procedure on a CMOS chip is proposed. This method utilizes magnetic beads as its assay marker and provides a simplified protocol. The chip is fabricated in a 0.35 μm standard complementary metal-oxide-semiconductor (CMOS) process. Just one post processing, etch back Hall sensor area, enhances its sensitivity and an RF drain current across it lowers...
This paper presents a multi-sensor platform LSI for versatile applications including next generation robots. For a unified system implementation, the proposed LSI, which was fabricated by TSMC0.13μm CMOS process and whose size is 2.83mm × 2.83mm, provides the following functions: several principle sensor readout circuits, 8-single or 4-differential multi-channels for multi-axis sensing, digital outputs...
In this study, we successfully developed a high signal-to-noise ratio (SNR) rangefinder based on a piezoelectric micromachined ultrasonic transducer (pMUT). A monocrystalline Pb(Mn1/3, Nb2/3)O3-Pb(Zr, Ti)O3 (PMnN-PZT) thin film was used because it has large figures-of-merit (FOM) for SNR due to its high piezoelectric coefficient and small relative permittivity (typical values: e31,f = −14 C/m2, εr...
We have developed a spot vacuum sealing method utilizing conventional thermo-compression bonding at 160 °C with a transportable Au particle plug on a silicon through hole. The plug of which diameter is around 200 μm is composed of sub-micron-size Au particles and an Au thin film. The easy deformability of sintered Au particles leads to the hermeticity with changing the structure to closed pore state...
This article reports a wafer-level heterogeneous integration and vacuum packaging technology by thermocompression bonding using electroplated Cu sealing frame planarized by single-point diamond fly-cutting. A high grain boundary density on the Cu surface induced by mechanical stress application during fly-cutting process enables vacuum sealing with bonding temperature as low as 250°C. At such low...
This paper reports a fully-integrated, small-footprint fingertip sensor, which allows robots to have 3-axis tactile and thermal sensation. The 3-axis capacitive force sensor is integrated with our original sensor platform CMOS-LSI (sensor platform LSI) including a diode-based temperature sensor. The LSI offers flexible configurability, and the force sensitivity and the sample rate were configured...
The present paper reports a 2.8-mm-square surface-mountable MEMS-on-LSI integrated 3-axis tactile sensor for robot applications, which incorporates sensing and signal processing in a single chip. The MEMS part has a quad-seesaw-electrode structure for fully-differential capacitive 3-axis force sensing. The LSI is an original sensor platform LSI equipped with deep annular-type through silicon vias...
This paper proposes a 20 mW class low-power and miniaturized oven controlled crystal oscillator (OCXO) by combination of the following two methods. (1) A crystal resonator and a CMOS-LSI for oscillation and oven control circuits are integrated for realizing an integrated OCXO chip. (2) The integrated chip is connected with thin film metal interconnection on a thin polyimide film and is suspended by...
In this study, we report a signal processing method for an immune-sensor chip, which uses immune-assay to trap a target material on it. The trapped material is labeled with micro magnetic beads and detected by Hall sensor array fabricated in a CMOS chip. To improve the signal-to-noise ratio of the Hall sensor, output signal is modulated at a high frequency region. The signal processing circuit, which...
This paper reports a frequency modulated (FM)/rate integrating MEMS gyroscope where superposed clockwise (CW) and counter clockwise (CCW) modes are independently controlled on a single resonator. A frequency and quality factor mismatch compensation method by adjusting the phases and amplitudes of driving signal is proposed and experimentally demonstrated. The mismatch compensation method proposed...
Aluminum with Sn intermediate layer shows very large deformation even below 400°C. Using this new layer structure as sealing metal, high yield hermetic package of MEMS was demonstrated at only 370°C without any treatment of surface oxide removal. During bonding, the bonding metal is significantly pressed (the reduction rate of thickness ∼90%), which guarantees hermeticity at high yield. Based on SEM,...
This paper reports a fully-differential frequency modulated (FM) gyroscope where superposed clockwise (CW) and counter clockwise (CCW) modes are independently controlled on a single resonator. A CW/CCW mode separator was implemented with a mode-matched ring resonator, and FM gyroscope operation with excellent linearity between applied angular rate and frequency difference was demonstrated. The scale...
This study has opened a possibility to fabricate through silicon vias (TSV) in a LSI wafer available by commercial multi-project wafer (MPW) service and integrate the LSI and MEMS by wafer bonding. 300 μm deep Cu annular type TSV were fabricated in a TSMC 0.18 μm CMOS LSI MPW cut into 4″ diameter. The developed TSV process managed mechanically fragile property of the laser-ablated MPW by low stress...
The integration of heterogeneous components or materials is a promising approach to create more functionalized, higher performance and smaller devices. However, there are technical problems in terms of process temperature limit, thermal expansion mismatch, process incompatibility, die size mismatch etc. To overcome such problems, significant efforts have been made in the world. This paper introduces...
The 0-th shear horizontal (SH0) mode plate wave has an electromechanical coupling factor k2 larger than 50% in a (0°, 120°, 0°) LiNbO3 (LN) plate thinner than 0.1λ, where λ is a pitch of an intergidital transducer (IDT). In the previous study, ultra-wide-band ladder filters composed of cavity type resonators recorded 6 dB bandwidth from 41% to 51% in a digital TV band. However, the structure is fragile,...
This paper reports an on-chip micro battery and a micro electrochromic display, both are key components of a disposable wireless bio-sensor. The on-chip micro battery had a simple structure and it could generate open circuit voltage and power density as high as 1.6 V and 78 µW/mm2, respectively. The micro electrochromic display made of micro patterned polyaniline could be made on an imitation of CMOS...
A 0-th shear horizontal (SHo) mode plate wave has an electromechanical coupling factor k2 larger than 50% in a (0°, 120°, 0°) LiNbOs (LN) plate thinner than 0.1λ (λ is a pitch of interdigital transducer). However, the structure is fragile, because the plate thickness is as thin as 0.5∼0.6 μm for devices working in several hundred MHz range. To address this issue, a solidly mounted resonator (SMR)...
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