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The Leadframe-Epoxy molding compound (EMC) interface is known to be one of the weakest interfaces in an electronic packaging exhibiting delamination during reliability test. Interfaces of EMC and leadframes with different metal coatings exhibit different failure mode behavior after environmental aging because of the different adhesion strengths. In this paper, the interface microstructure of EMC-leadframes...
Conventional lead-free solders, with a solder alloy particle size in the micrometer range, present some major disadvantages, such as relatively high melting temperatures, which can result in defects and build up stresses during reflow processing, and limited application for high density, ultra- small pitch electronic applications. By decreasing the size of the solder alloy particles to the nanometer...
Soldering with lead-free tin-based solder alloys demands substantially higher processing temperatures compared to conventional tin-lead solders, resulting in both significantly greater growth rates of Intermetallic Compounds (IMCs) and dissolution of surface finish layers. In this paper, the interfacial reactions between a new lead-free solder composition, eutectic Sn-0.7Cu- 0.4Co, and Electroless...
This paper investigates a composite solders obtained by adding Sn-3.0Ag-0.5Cu (SAC) nano-particles into conventional eutectic Sn-58Bi solder paste. The microstructure analysis and the measurement of the Vickers microhardness have been carried out. Utilizing the self-developed consumable-electrode direct current arc (CDCA) technique, the Sn-3.0Ag-0.5Cu nano-particles with an average particle size between...
Nanopowders of Sn-3.0Ag-0.5Cu (wt.%) alloy, which has the promising potential applications in microelectronics packaging as the lead free solder, were prepared under the protection of three various coolants. The oxidation of the nanopowders was measured by X-ray diffraction (XRD) and other relative methods to compare the protection of the nanopowders during their preparation. Moreover, the scanning...
Microstructural features and tensile properties of Sn-3.0Ag-0.5Cu solder joints on copper with various aging time at 150degC were examined. The solder inner and solder/Cu interface were analyzed by SEM to identify the fracture location, morphology and compositions. The study has showed, the tensile fracture strength of the solder joints decreases with the increased aging time, and the crack initiates...
Interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Ni/Cu substrate have been investigated after reflow and high temperature storage. The reflow peak temperature at 265degC and a total duration time of 6 minutes were used. The duration time at the peak temperature of the reflow process was approximately 2 min. The aging temperature was 150degC and the duration time was 100 h,...
The mechanical bending test results, as well as the modeling and calculation data were presented in this study to characterize the solder joint reliability. Bending test was completed simply by loading a series of displacements on the FR-4 printed circuit board (PCB) with devices and solder joints in single direction. A special bending tester that can control displacement exactly by a cam system was...
Nanoparticles of Sn-4.0Ag-0.5Cu and Sn-0.4Co-0.7Cu (wt% composition) lead free solder alloys were manufactured and characterized for potential applications in microelectronics packaging. Scanning electron microscopy (SEM) analysis was carried out in order to study the morphology and size distribution of the nanoparticles. It was observed that nanoparticles of lead free alloys were almost spherical...
The Sn-Co-Cu eutectic solder alloy is a less expensive and is therefore a possible alternative to the Sn-Ag-Cu alloys. The Sn-Co-Cu system eutectic composition was obtained by means of CALPHAD (calculation of phase diagram) methodology. The composition of the Sn-rich, eutectic Sn-Co-Cu system was found to be 0.4%Co and 0.7%Cu (wt%) with a melting point of 224degC The tensile behavior of the eutectic...
The interfacial reactions between Sn-0.4Co-0.7Cu eutectic alloy and immersion Au/electroless Ni(P)/Cu substrate were investigated after reflow soldering at 260degC for 2 minutes. Common Sn-4.0Ag-0.5Cu and eutectic Sn-0.7Cu solders were used as reference. Two types of intermetallic compounds (IMC) were found in the solder matrix of the Sn-0.4Co-0.7Cu alloy, namely coarser CoSn2 and finer Cu6 Sn5 particles,...
The Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni-immersion Au metallization exhibited different interfacial morphology after high temperature storage (HTS) testing at 150degC. Ni3Sn4 intermetallic compounds (IMCs) were found in the Sn-Ag system, while in the Sn-Ag-Cu system, spalling grains of (Cu,Ni)6Sn5 IMC were observed after long aging, along with a thick (Ni,Cu)3Sn4 IMC layer which adheres...
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