Search results for: Fengqun Lang
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 8 > 1069 - 1074
Journal of Electronic Materials > 2015 > 44 > 1 > 482-489
Gold Bulletin > 2014 > 47 > 1-2 > 109-118
Journal of Electronic Materials > 2011 > 40 > 7 > 1563-1571
Journal of Materials Science: Materials in Electronics > 2010 > 21 > 9 > 917-925
IEEE Transactions on Advanced Packaging > 2009 > 32 > 4 > 773 - 779
Intermetallics > 2007 > 15 > 4 > 599-606
Oxidation of Metals > 2007 > 68 > 5-6 > 343-363
Materials Characterization > 2005 > 54 > 3 > 223-229
Intermetallics > 2004 > 12 > 5 > 469-475
Intermetallics > 2004 > 12 > 4 > 451-458
Intermetallics > 2003 > 11 > 7 > 697-705
Intermetallics > 2003 > 11 > 2 > 129-134