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The high-temperature reliability of active metal brazed copper (AMC) on Si3N4 ceramic substrates used for fabricating SiC high-temperature power modules was investigated under harsh environments. The AMC substrate underwent isothermal storage at 300°C for up to 3000 h and a thermal cycling test at −40°C to 300°C for up to 3000 cycles. During isothermal storage at 300°C, the AMC substrate exhibited...
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