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A fully-integrated antenna-in-package (AiP) solution for W-band scalable phased-array systems is demonstrated. We present a fully operational compact W-band transceiver package with 64 dual-polarization antennas embedded in a multilayer organic substrate. This package has 12 metal layers, a size of 16.2 mm × 16.2 mm, and 292 ball-grid-array (BGA) pins with 0.4 mm pitch. Four silicon-germanium (SiGe)...
This paper presents a multi-function, dual-polarization phased array transceiver supporting both radar and communication applications at W-band. 32 receive elements and 16 transmit elements with dual outputs are integrated to support 16 dual polarized antennas in a package. The IC further includes two independent 16:1 combining networks, two receiver downconversion chains, an up-conversion chain,...
This article summarizes the development of mature and highly integrated SiGe BiCMOS ICs for gigabit-per-second communications according to the requirements of the IEEE 802.15.3c and 802.11.ad-draft standards. A single-element transceiver chipset for point-to-point communications is described with emphasis on a feature-rich yet compact 60-GHz receiver. Next, a 16-element phased-array transceiver chipset...
This paper presents the first 60GHz two-element phased array front-end in silicon which achieves RF-path phase-shifting enabling low power 60GHz array implementation. Each element in the 0.13μm SiGe BiCMOS front-end incorporates a novel variable-gain LNA, 60GHz reflection-type phase shifter (RTPS) and a phase-inverting variable-gain amplifier (PIVGA), and provides 360° phase variation across the 60GHz...
This paper presents a scalable phased-array receiver system that covers a tritave bandwidth of 6-to-18 GHz implemented in a 130nm CMOS process. The single receiver element with a 10-bit phase shifting resolution achieves a maximum phase error of 2.5° within a baseband amplitude variation of 1.5dB for an arbitrary target angle. This dense interpolation provides excellent phase error/offset calibration...
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