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A nanoelectromechanical mass sensor is used to characterize material deposition rates in stencil lithography. The material flux through micron size apertures is mapped with high spatial (below 1 mum) and deposition rate (below 10 mum/s) resolutions by displacing stencil apertures above the sensor. The sensor is based on a resonating metallic beam with submicron-size width and thickness. The beam is...
A fully integrated nanoelectromechanical system (NEMS) resonator together with a compact built-in complementary metal-oxide-semiconductor (CMOS) interfacing circuitry is presented. The proposed low-power second generation current conveyor circuit allows measuring the mechanical frequency response of the nanocantilever structure in the megahertz range. Detailed experimental results at different DC...
Wafer scale nanostencil lithography is used to define 200 nm scale mechanically resonating silicon cantilevers monolithically integrated into CMOS circuits. We demonstrate the simultaneous patterning of ~2000 nano-devices by post-processing standard CMOS wafers using one single metal evaporation, pattern transfer to silicon and subsequent etch of the sacrificial layer. Resonance frequencies around...
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