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Two precise lens-assembly techniques based on the adhesive bonding and hammering are proposed. These techniques allow us to realize a compact 100GbE TOSA 15.1 × 6.5 × 5.6 mm which is suitable for the QSFP28 form factor. The measured DC output powers are more than +4.0 dBm which fully achieve the target value of+1.0 dBm with the large margin.
Recently, solar power generation using crystalline silicon wafers has been rapidly growing. It is well known that the mechanical properties of silicon wafers are affected by defects caused by slicing processes of the wafers. However the effect of the defects on the mechanical properties, especially, strength of the crystalline silicon wafers has not been clarified yet. In this paper, to clarify the...
Solar power generation using polycrystalline silicon wafers has been rapidly growing in recent years. As a result, it is required to understand the strength characteristics of polycrystalline silicon wafers in order to enhance their quality. Scratches and material defects should be taken into consideration when strength characteristics of polycrystalline silicon are evaluated, since it is a brittle...
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