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Flexible Pressure Sensors
Inspired by splashed particles from laser processing, in article number 2207362, Liang Guo and co‐workers propose a method for mold/mask‐free fabrication of microstructured flexible electrodes by femtosecond laser‐activated metal deposition. The capacitive pressure sensor with such electrodes presents outstanding performance and can be easily made into arrays for spatial...
Flexible pressure sensors play an indispensable role in flexible electronics. Microstructures on flexible electrodes have been proven to be effective in improving the sensitivity of pressure sensors. However, it remains a challenge to develop such microstructured flexible electrodes in a convenient way. Inspired by splashed particles from laser processing, herein, a method for customizing microstructured...
Cu wires are coated by porous/dense Ni bi-layers as current collectors through electroless plating and hydrogen bubble dynamic template electrodepostion methods. The unique coaxial composite current collectors can be beneficial from the high electrical/thermal conductivity of metal Cu core and high corrosion resistance of dense metal Ni coating as well as porous Ni substrate for growth of active materials...
3D hierarchically porous Cu@Cu2O films supported Pd nanoparticles with excellent electrocatalytic activity are synthesized through electrochemical deposition, anodic oxidation and redox growth. Enzyme-free glucose biosensors based on the porous Cu@Cu2O-Pd electrodes exhibit higher sensitivity (1.157mAcm−2mM−1) than those of the porous Cu@Cu2O films (0.607mAcm−2mM−1), porous Cu films (0.507mAcm−2mM...
Al2O3 coated graphene foam (GF@Al2O3) composites are proposed by depositing insulating Al2O3 particles on the graphene with a simple method. The content of Al2O3 on graphene could be gradually adjusted by changing Al(OH)3 radio in solution. Al2O3 coated graphene foam composites are used as effective three dimension (3D) interconnected framework of paraffin phase change materials to increase thermal...
Low melting alloy is mixed with Cu filler as thermal interface materials. The thermal performance is investigated by inserting the composite between Al blocks. The ratio of Cu filler is optimized to be 50% to achieve the lowest thermal resistance.
Graphene foam (GF), carbon fibers (CFs) and GF/CFs reinforced epoxy resin composites were fabricated and their thermal properties were investigated. Due to continuous interconnected structures of GF and avoiding the CFs aggregation in epoxy resin, GF/CFs reinforced epoxy resin demonstrates greatly higher thermal conductivity than the single GF or CFs reinforced epoxy, which could provide a strong...
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