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A finite element model for evaluating the performance of the MEMS air flow sensor with sapphire as substrate was established. The temperature distribution of the MEMS sensor chip with respect to different air flow was calculated by COMSOL Multiphysics. The trenches etched in the substrate were used to reduce the heat transfer from the heater to the temperature measuring thermistors within the substrate...
Compared with traditional spinning disk or wheel mechanical gyroscopes, MEMS gyroscopes are lighter in weight, smaller in dimension, lower in cost and energy saving. MEMS gyroscopes have been important components in consumer electronics, automotive electronics, etc. MEMS gyroscope is a rotation sensing component, and that means working in dynamic environment where acceleration, temperature and electromagnetic...
This paper presents a minimized wearable inertial measurement units (IMU) which consists of a three-axis accelerometer, a three-axis gyroscope, a three-axis magnetometer. These sensors are Micro-electromechanical Systems (MEMS) devices, which have advantages of lower cost, smaller size and lower power consumption. The size of MEMS IMU is 23×23×4mm that is small enough to be easily fixed on hand, waist...
It is well known that temperature variation affects a MEMS device's performance. In this paper, the effect of temperature on the whole MEMS based gyroscope is observed by recording and analysis the zero rate output (ZRO). The effect of temperature on the ZRO comes from material parameter changing and electronic parameter changing. With temperature changing, the ZRO of the gyroscope suffers from changes...
This paper presents a minimized wearable inertial measurement units (IMU) which consists of a three-axis accelerometer, a three-axis gyroscope, a three-axis magnetometer. These sensors are Micro-electromechanical Systems (MEMS) devices, which have advantages of lower cost, smaller size and lower power consumption. The size of MEMS IMU is 23×23×4mm that is small enough to be easily fixed on hand, waist...
Compared with traditional spinning disk or wheel mechanical gyroscopes, MEMS gyroscopes are lighter in weight, smaller in dimension, lower in cost and energy saving. MEMS gyroscopes have been important components in consumer electronics, automotive electronics, etc. MEMS gyroscope is a rotation sensing component, and that means working in dynamic environment where acceleration, temperature and electromagnetic...
The mechanism of resonant frequency shift of MEMS gyroscope subjected to environment temperature change was investigated comprehensively in this paper, and its computational model was set up based on certain assumptions. Taking the structure of MEMS gyroscope as an example using the finite element method, firstly, the authors derived the simplified M-C-K dynamic model. Then, thermal stress and the...
This paper presents a method to calculate the air damping coefficient and the quality factor value in MEMS gyroscope at different cavity pressures. Taking the structure of MEMS gyroscope as an example, firstly, the authors derived the simplified M-C-K dynamic model. Then, the elements of mass matrix and stiffness matrix were calculated based on certain assumptions, especially the air damping coefficient...
In this paper, we conduct simulation of MEMS pressure sensors based on graphene membrane by using COMSOL finite element software and comparatively study the deflection and stress distribution of rectangular and circular vacuum cavities applied by a pressure. we also analyze the change rule of graphene membrane stress and maximum deflection distance for the two kinds of pressure sensor with different...
During SOI-based gyroscope fabrication, wet etching in hydrofluoric acid is utilized to etch buried oxide layer(BOX) and release micro-structures of the gyroscope. The BOX layer is beneath the micro-structures, and it's not easy to observe when the release process is finished, so a gradual release experiment is conducted to find the right etch time. Release experiment is carried out in two kinds of...
In this paper, experiments were carried out to fabricate a kind of free-standing silicon nitride thin film which was applied to many MEMS devices, especially for the gas flow sensors and Pirani. A series of manufacturing processes were researched and optimized to obtain perfect experimental results. LPCVD silicon nitride, dry etching silicon nitride and wet etching silicon were carefully studied in...
3D integration and packaging with through silicon via (TSV) is a promising method to overcome the limitation of integration scale in Micro-Electro-Mechanical Systems (MEMS) packaging. It is helpful to realize high density and reliability micro-devices. The technology of fabricating copper (Cu) TSVs by electroplating is applied to provide signal connection in vertical direction. However, the fabrication...
Comb structures are widely used in MEMS (Micro-Electro-Mechanical-System) devices, especially in MEMS gyroscope, which is used for electrostatic actuation or capacitive detection. This paper has studied the behavior of non-ideal comb structures. As the presence of fabrication imperfections, the defects like tilting and inclination of the finger are generated due to ICP etching. In this research, FEM...
Through silicon via (TSV) is an emerging technology for MEMS packaging for MEMS packaging. 370µm deep TSV vias with diameter of 60µm were filled by bottom up copper electroplating with copper methylsulfonate and methane sulfonic acid as base electrolyte. Insulating layer of the wafer was silicon nitride deposited by LPCVD. The TSV vias filling processes include electroplating to fill the vias and...
MEMS (Micro-Electro-Mechanical Systems) have been used widely in almost all the major industries, while few companies have commercial products in MEMS gyroscope. Besides, there are not many papers on the sensor design, and the papers regarding the packaging for gyroscopes are few, partly due to its highly proprietary nature [1]. The fabrication imperfections are unavoidable during MEMS gyroscope manufacture...
Miniaturized atomic clock that could provide the most stable frequency reference is demanded strongly in a large number of applications such as communication, satellite navigation and science measurement etc. The miniaturization is mainly developed by CPT phenomenon which depends on the miniaturized atomic vapor cell without microwave cavity. With the rarely reported triple-stack anodic bonding in...
An improved pictorial structure method (PS) is presented in this paper for structure detecting and matching in microscopic images of the micro structure fabricated using micro-fabrication technology. The obtained structure information of the micro objects is important for the following 3D visual calculation process. Although PS method can extract and match features successfully by evaluating the appearance...
On the purpose of 3D reconstruction, this paper proposes a novel template based method for detecting and matching key points in microscopic images of Micro Electromechanical System (MEMS) components. Since the feature detection and matching is already a difficult problem, selecting features that can reflect the information of object structure and be matched well in microscopic images of MEMS components...
Many MEMS devices such as accelerators, gyroscopes, un-cooled infrared sensors, etc. require vacuum packaging. The vacuum maintaining lifetime directly determines the vacuum packaging reliability. This research presented a quantitatively analysis of the relationship between the leak rate and the vacuum maintaining lifetime, and demonstrated the leak rate measurement plays great importance. This paper...
In spite of the fact that anodic bonding technique has be extensively utilized in the microelectromechanical systems (MEMS) for the packaging of microsensors and microactuators, some key issues, such as decreasing anodic bonding temperature, improving bonding strength and reducing bubbles in the bonding interface, must be resolved. In the paper, the anodic bonding process of a micro sealing cavity...
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