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A spectrally tunable add-drop filter based on a whispering gallery mode in a double dielectric microdisk pair with an air gap is proposed, and its operation process and performance are demonstrated by finite-difference time-domain simulation.
We introduce a three-dimensional plasmonic ruler based on silver metal double nano-blocks. Two resonant modes shows different wavelength dependences on x- or y- directional shift of blocks, which enables the measurement of spatial position with nanometer resolutions.
The development and miniaturization of electronic devices and components is pushing the system devices and their interconnecting interfaces to become even smaller. Thus, reducing the size of receiver (Rx) and transmitter (Tx) chips plays an plays an important role in designing a small-size optical modules utilized in o/e and e/o converters. Therefore, designing a small-area optical Rx may require...
Designing of a small-area optical receiver (Rx) may require intuitive solutions, such as building single-ended Rx and utilizing some of the advantages of differential Rx. Optical Rx should provide sufficient gain and frequency operation for feeding to subsequent blocks including clock and data recovery circuit (CDR) and/or Serializer and Deserializer (SerDes) with reduced size for building compact...
A new fluorescence enhancement technical platform based on the lithographically patterned anodic aluminum oxide (AAO) nanostructures is reported for the first time. The fluorescence images of several types of fluorescent dyes on the AAO and Au-coated AAO substrates have been obtained and examined. Significant fluorescence enhancement has been observed. This type of AAO-nanostructure platform has potential...
In this work, an analytical model based on interconnect parameters is presented for the analysis of thermal effects on crosstalk and performance of multi-channel optoelectronic modules. The model is used to determine the thermal critical frequency, fcrit, above which signals becomes severely deteriorated and can be applied in the design and packaging of optoelectronic modules for reliable data transmission.
A proposed power-aware optical interconnection system consists of a supply control voltage regulator, a receiver circuit, and a transmitter circuit. The supply control voltage regulator power consumption is 220 µA at 3.3 V and the optical receiver and transmitter has 27 mA and 64 mA at 1.8 V respectively. The transient response of supply control voltage regulator has 3.1 ns and 0.4 ns for rising and...
This work demonstrates the thermal analysis for efficient heat dissipation for optoelectronic transmitter modules. A Teflon-based thermal printed circuit board (PCB) has been designed for packaging the designed and fabricated transmitter modules to ensure efficient heat dissipation. The thermal and performance analysis of the packaged modules show that the chips operate at temperatures below 40 °C...
As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. This paper describes equivalent circuit extraction based on 3D full wave simulation for optoelectronic transmitter packaging interconnects. Simulation and extraction are performed for two kinds of transmitter modules: planar and multi-chip modules. The extracted equivalent...
In this paper, the characterization of spiral inductors and the design of a novel spiral inductor based on low temperature co-fired ceramics (LTCC) is described. Due to the semi-stacked nature of the inductor, a peak quality factor (Qmax) of 43.3 and an effective inductance Leff of 14.41 nH has been obtained. Our novel spiral inductor occupies a smaller area when compared with the conventional planar...
An interconnection scheme for chip-to-chip optical link has been proposed in this work where the silicon substrate of the driver integrated circuit (IC) is used as a subcarrier and also as a light path. This interconnection scheme uses a low loss high speed reconfigurable optical printed circuit board (REOPCB) for coupling light from one chip to the other. A multichip transmitter module has been fabricated...
As the speed of integrated circuits increases, inductive coupling becomes an issue for the packaging interconnect technologies. Two transmitter modules (planar and multichip) have been fabricated for crosstalk analysis. The modules are prepared using 1×4 VCSELs and driver integrated circuit (IC) fabricated in a 0.18 µm Si-CMOS technology. The planar module has been fabricated using the conventional...
We report the implementation of a transimpedance amplifier (TIA), using the combination of the shunt-feedback topology with the regulated-cascode input stage and broadband matching network, in a 0.13 µm CMOS technology. The proposed TIA achieves a 3-dB bandwidth of 7.5 GHz, transimpedance gain of 50 dBΩ in the presence of 300 fF photodiode capacitance, a gain-bandwidth product per DC power figure...
A bidirectional optical transceiver integrated with a novel transmission envelope detector for controlling the transmitting direction automatically is proposed. The transmission envelope detector detects the present of received signals to generate the directional controlling signals. Implemented in a 0.18 mum CMOS technology, the bidirectional optical transceiver occupies an area of 1.08 mm2 and dissipates...
An electrical/optical (E/O) module integrated with a combined transmitter/receiver (Tx/Rx) and multiplexer/demultiplexer (Mux/Demux) is proposed. With this topology, a high efficient bidirectional optical link can be implemented in the term of saving power consumption, chip area, board area as common blocks are shared between Tx and Rx as well as Mux and Demux. Based on this topology, a design of...
In this paper, an electrical/optical (E/O) module integrated with a combined transmitter/receiver (Tx/Rx) and multiplexer/demultiplexer (Mux/Demux) for optical interconnection is proposed. The proposed topology is very compact and less power consumption. A design of 2-channels Tx/Mux and Rx/Demux using TSMC 0.18 mum CMOS technology is presented with post simulation results are 4 GHz of 3-dB bandwidth...
A bidirectional optical transceiver with an automatically directional controlling function is designed and implemented in a 0.18 mum CMOS technology. A novel transmission envelope detector functions as the directional controlling block to generate the controlling signals according to the received optical signal. The bidirectional optical transceiver achieves a 3-dB bandwidth of 4.4 GHz and 4 GHz in...
A MEMS-based tunable optical nanoantenna is described. The optical performance of the tunable antenna has been investigated using rigorous finite difference time domain (FDTD) method. It reveals that peak wavelengths and local field enhancements are largely affected by the size and shape of the bowtie antenna. The optical field can be drastically enhanced by reducing the gap size less than 30 nm which...
A MEMS-based tunable optical nanoantenna is described. The capability of the nanometer resolution and repeatability offered by the MEMS actuators paves the way for the tunable optical antennas, which is confirmed by both modeling and experimental measurements. The MEMS-based tunable antenna offers many advantages in terms of cost-effective fabrication, dynamic optical intensity enhancement, dynamic...
Signal latency between optical and electrical interconnections is modeled and evaluated. As interconnection length is increased latency is also increased and signals become asynchronous. To compensate this latency, a signal synchronizing block which can synchronize the asynchronous signal according to clock signal is proposed and designed in this paper. This synchronizing block is consists of D flip-flop,...
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