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Immersion solder bumping, a mask-less and low cost processing, brings feasibility to the ultra-fine pitch chip-to- chip interconnection; however, how to make the uniform micro-bump is still a great challenge. In this paper, the uniform micro-bumps with very thin Sn-3.0Ag-0.5Cu (SAC305) solder layer on electroless nickel under bump metallization (UBM) are achieved. The test chips we used have 6,507...
This study was aimed to realize the influences of microstructure and shear speed on the fracture behavior of solder ball. The shear behavior of Sn-37Pb, Sn-0.3Ag-0.7Cu, Sn-1Ag-0.5Cu, Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.06Ni-0.01Ge in solder joint on ball grid array substrate was investigated with differently high shear speed from 10 mm/sec to 1000 mm/sec. The shear speed was found to have strong effect...
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