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We investigate a novel Ti Chemical Vapor Deposition (CVD Ti) technique for source/drain and trench contact silicidation. This work is a first demonstration of a highly selective, superconformal Ti process that exhibits a low p-type CVD Ti/SiGe:B contact resistivity (pc) down to 2.1×10−9 Ω.cm2 (a 40% reduction vs. PVD Ti), matching the lowest published values [1-5]. A competitive n-type CVD Ti/Si:P...
Ferroelectric HfZrOx (FE-HZO) FETs is experimentally demonstrated with 0.98nm CET (capacitance equivalent thickness), small hysteresis window VT (threshold voltage) shift < 0.1V, SSfor = 42mV/dec, SSrev = 28mV/dec, and switch-off < 0.2V. The optimum ALD process leads single monolayer SiOx for IL (interfacial layer) and low gate leakage current. The FE-HZO FETs is operated at room temperature...
Ta/Si bilayer thin films were prepared by magnetron sputtering. The recording mechanism and dynamic tests for write-once blu-ray disc (BD-R) are investigated. Thermal analysis shows that the Ta/Si bilayer thin film has a reflectivity change with the temperature ranging from 130 °C to 300 °C. It was found that the as-deposited phase of Ta/Si bilayer film was Ta phase and it would transform to Ta and...
Strain techniques have been adopted and widely used in the advanced nodes since early 65nm for carrier mobility improvement. For PMOS, eSiGe incorporation in the SD is the process of choice to induce compressive strain in the channel for mobility improvement. To further lower the contact resistance, it is preferred to boost Boron concentration for pSD formed by eSiGe process. Normal implant process...
P-doped silicon rich oxide (SRO) /silicon dioxide (SiO2) superlattices, deposited by sputtering method under different substrate temperatures, were treated using conventional furnace annealing or rapid thermal annealing (RTA). Raman and X-ray diffraction (XRD) were used to characterize the samples. Results show larger nanocrystal size is formed by furnace annealing than by RTA. High crystallinity...
We report the deposition and characterization of thin ZnO films on 〈100〉 silicon substrates employing Atomic layer deposition (ALD). This technique is considered to have a great potential for nano-scale applications due to its excellent conformality, total surface coverage, uniformity, accurate thickness control, its ability to deposit high k-dielectrics, metals, nucleation layers and barrier materials,...
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