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We propose a novel floorplanning algorithm for 3D ICs with through-silicon vias (TSVs) that directly optimizes delay due to wires and TSVs. We include the non-negligible impact of area occupied by TSVs, perform nets-to-TSVs assignment, and use physical dimensions of TSVs and wires for delay calculations. Our floorplanning is based on co-placement of TSV islands with circuit blocks and is performed...
We propose a new scheme of dynamic nets-to-TSVs assignment during floorplanning for 3D-ICs. A nontrivial area occupied by TSVs, their physical dimensions, location on the layout and the nets-to-TSVs assignment, are some of the key factors influencing the wirelength, TSV count and chip area, and consequently, impact the total delay. We address the above issues by simultaneous placement of TSV islands...
We propose a new floorplanning approach for TSV-based 3D ICs. A non-negligible area occupied by TSVs, TSVs physical locations and nets-to-TSVs assignment considerably influence chip area, wirelength and delay. TSVs also induce significant thermo-mechanical stress in nearby silicon. The proposed approach addresses the above issues by co-placement of TSVs with circuit blocks, and concurrent nets-to-TSVs...
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