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This paper proposes a coarse-grained dynamically reconfigurable architecture that offers flexible reliability to deal with soft errors and aging. The notion of a cluster is introduced as a basic architectural element; each cluster can select four operation modes with different levels of spatial redundancy and area efficiency. We evaluate the aging effect due to negative bias temperature instability...
In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package. The result shows the strain-controllable dynamic bending method can...
This paper proposes a coarse-grained dynamically reconfigurable architecture, which offers flexible reliability to soft errors and aging. A notion of cluster is introduced as a basic element of the proposed architecture, each of which can select four operation modes with different levels of spatial redundancy and area-efficiency. Evaluation of permanent error rates demonstrates that four different...
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