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Delamination is an important failure mechanism of plastic packaging devices. In this paper, the delamination variation trend of two kinds of plastic packaging devices were traced through combined reliability test. Test condition was designed based on the actual operating condition of the device. C-SAM inspection was carried out after each test. It is observed that delamination was expansion during...
Large scale and high density packaging of ASICs are usually achieved by FCBGA forms. The structure and materials are more complicated in FCBGA, which would cause reliability concerns in situations where thermo-mechanical stressing is dominant. Accelerated temperature cycling reliability test was performed on 90-nm/8-level copper based FCBGA packaging devices, and open failures dominated by thermo-mechanical...
ESD sensitive test was performed to verify the design of circuit protection unit. The failure ICs were analyzed by OBIRCH technique. Three anomalous thermally sensitive sites were localized including I/O and VCCIOs. OBIRCH analysis confirmed the failure sites were directly connect to the pads, mostly ESD protection units, decoupling capacitor and internal inverter. Physical failure analysis confirmed...
Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost, size, weight and product variety. However, PEMs are non-hermetic package and the plastic mold materials are inherently hygroscopic and absorptive, so the PEMs are permeability to moisture. Furthermore, the mismatch of coefficient of thermal expansion between the mould compound...
Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost, size, weight and product variety. However, PEMs are non-hermetic package and the plastic mold materials are inherently hygroscopic and absorptive, so the PEMs are permeability to moisture. Furthermore, the mismatch of coefficient of thermal expansion between the mould compound...
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