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A potential technology by substrate interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-capacity of memory. This paper presents a new High Bandwidth Package-on-Package (HB-PoP) structure with substrate interposer...
As clock speeds increase into the gigahertz regime and rise times decrease into the pico-second regime, the interaction between capacitors and power/ground planes of a package, or board on which they are mounted becomes vitally important to the performance of a power delivery system. Capacitors pose the biggest challenge for integration in packages due to the large capacitance required for decoupling...
As clock speeds increase into the gigahertz regime and rise times decrease into the pico-second regime, the interaction between capacitors and power/ground planes of a package, or board on which they are mounted becomes vitally important to the performance of a power delivery system. Capacitors pose the biggest challenge for integration in packages due to the large capacitance required for decoupling...
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