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Planar Strain mapping of interconnects, such as Ball Grid Arrays (BGA) and Through-Silicon Vias (TSVs), is an important step in the development and testing of electronics packages, as excessive strain can lead to device failure. Today, the two most widely adopted methods of experimental strain field measurement, Digital Image Correlation and Moiré Interferometry, encounter limitations when the average...
Unevenly distributed thermal strain, among materials with different coefficients of thermal expansion (CTE) within electronic packages under operation, affects the working performance for the whole unit. The points that experience the highest strain are most likely to be the failure locations. Knowledge of the strain distribution across the package is in great need in order to analyze the failure...
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