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Fine pitch copper wire bonding presents challenges to both first and second bond processes. Corrosion of the first bond copper-aluminum (Cu-Al) intermetallic compound bond interface layer can be induced by mobile chlorine in the epoxy mold compound, and the second bond process window can be narrower than with gold wire. Palladium-coated copper wire is believed to overcome these two problems, however,...
This study describes the development of a Cu wire bond assembly solution for ICs using low dielectric constant (low K) dielectrics and Cu interconnect, with bond pads designed with aggressive BOA (Bond Over Active) design rules. The various wire bonding challenges imposed by the bond pad material stack and the aggressive high density BOA design will be discussed. It is desired to use the aggressive...
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