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A lens-integrated surface-emitting laser array has been developed for an optical module compliant with Parallel Single-mode 4-lane Multi-Source Agreement (PSM4 MSA) for 100GbE applications. High-efficiency optical coupling to SMF with two-lens configuration and uncooled 25-Gb/s operation over all four-channels were demonstrated.
In this paper, a new structure of silicon tactile imager with SU-8 protective layer is presented. The protective layer is formed on the surface of integrated piezoresistor array to prevent direct contact of the sensor surface to the object. The protective layer is formed individually on each pixel circuit to prevent degradation of the spatial resolution. This tactile imager is fabricated by an established...
A low-voltage high-speed bulk-CMOS SRAM that operates over 100MHz at 0.5V, for the first time, is proposed. A novel 8-transistor (8T) memory cell with a complementary read port (C-RP) improves the read speed by enabling differential bit-line sensing, while the conventional 8T SRAM drives the bit line with a single read port (S-RP). The cell layout of the C-RP SRAM has point symmetry and a small area...
In this paper, the optical design of astronomical detector array with SIS for 600-700 GHz is proposed. A unit has 127 pixel, and SIS junctions are coupled to double slot antennas and extended hemisphere lens made from Silicon or Alumina ceramics. A lens with multi-pixel system is compared to 1 lens with 1 antenna system (fly-eye)from the view point of antenna spacing, aberration, and beam efficiency.
In this paper, we present imaging of the physiological cell reaction of stimulus-responsive cells using a new orifice channel chip named the TISSUE-MIMICKING IN VITRO ANALYSIS SYSTEM. The chip enables designated cells treatment using orifice-channels similar to blood vessels, and cell-array like a tissue: cells are along on the blood vessels. These cell handling is an important part in the observation...
Recently high density packaging technologies have been strongly requested to realize ubiquitous networking society. A wafer-level chip size packaging (W-CSP) technology is one of the most promising technologies for high density and environmental friendly packaging. Purpose of this study is to fabricate system in package (SiP) by using W-CSP technology. In this study, we have fabricated two chip module...
This paper presents the non-iterative design for a waveguide slot array with cavities. The cavity dimensions to make the active slot admittance equal to that of an isolated slot are irrespective of the slot coupling except for a strong coupling. We can use the parameters of the isolated slot in the half-free space for required coupling. Once the slot parameters are determined, they are not iteratively...
The alternating-phase feed single-layer slotted waveguide arrays with baffles are analyzed by the S2DS method. The unit model of two slots is considered in order to determine the initial parameters for the S2DS array analysis. The measured reflection and gain of the antenna designed by the S2DS method have good agreements with the simulated results by HFSS over a wide frequency band. The reflection...
In this study, we propose a Genetic Extended-fiber Network (GEN) separately stretched over microbridges for DNA fiber applications. The microbridges are rapidly and easily fabricated by directly spin-coating a thick negative photoresist on a metal mask patterned glass substrate and exposing it twice from the backside of the substrate for two different exposure angles. The GEN constructed over microbridge...
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