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Recently, memory and storage have taken a front seat in computer hardware as it experiences an explosive growth at a rate faster than Moore's law for the past 10 years. With the upcoming challenges for further FLASH scaling into the next generations, emerging technologies have appeared portraying perspectives with the potential to shift computer architecture concepts. Here we present a brief overview...
Lead-free (LF) solder joints of portable devices are frequently subjected to unintentional drop, bend, shear and thermal cycling loading during transportation, handling, and usage. Various underfills are widely used in the electronics industry to deal with these challenges, however, the above approaches have some intrinsic shortcomings such as high material costs, low manufacturing assembly rate,...
In this paper we present the development of a compact, thermo-optically stable and vibration and mechanical shock resistant mounting technique by soldering of optical components. Based on this technique, new generations of laser pump sources for aerospace applications are designed. In these laser systems the used soldering technique replaces the glued connection between the optical component and its...
We propose three new synthesis methods for memristive implication logic and compare these with each other and with a basic method which was originally proposed in [5]. The results show that by using complementary representation of variables and multi-input operation, the lengths of computational sequences required for computing a given Boolean function are significantly reduced; for the three-input...
The hysteretic nature of the filamentary electron transport in MIM/MIS resistive switching devices is modeled within the framework of the Landauer theory for mesoscopic conductors. It is shown that a two-equation system, one equation for the current-voltage (I–V) characteristic of a nano-sized constriction and a second equation for the time dependence of the confining potential yield the wide variety...
The volume resistivity is an important parameter to reflect the electric performances of the insulation materials. In traditional two-electrode testing system for volume resistivity, the influence of the surface current doesn't be taken into consideration. As a result, higher testing error could be brought about for some insulation materials, especially for those with high resistivity. In order to...
A theoretical model of thermoelectric device was proposed that uses automobile exhaust gas for power generation. According to the principal of Fourier's law of heat conduction and the Peltier effect, a thermodynamics analysis was conducted in which expressions for calculating the output power and the efficiency were derived. Some influencing factors, such as the temperature distribution of the TEG...
This paper presents the development of a tactile sensor using single miniature sensing element based on pressure sensitive conductive rubber and outlines the resistance measurements performance. This sensor is specially designed for a robotic hand developed at UiTM Faculty of Mechanical Engineering. Nevertheless, the low cost, low density and flexible material is suitable for most robotics hand designs...
PPE exposed to arc flash is not always designed for arc flash exposures. This paper discusses the critical PPE rated for arc flash exposures for electrical workers and the test methods employed for those ratings. It also further explores other PPE which is frequently exposed to arc flash but which is not arc-rated. The purpose of the paper is to provide some guidelines on proper use and dangers posed...
Conductive adhesives provide advantageous properties for many electronics assembly applications (low processing temperatures, high flexibility) and they are green materials. However, the limited electrical and thermal conductivity of conventional conductive adhesives restrict their usage in most cases to low to medium power density packages. The novel mAgic silver sinter adhesives feature the conventional...
Terahertz (THz) photoconductive antennas are the most common devices for the generation and detection of THz waves. One of the main problems of the current photoconductive antennas as the emitter is that the optical-THz conversion efficiency is very low, thus it is difficult to obtain high power THz radiation. Impedance mismatching between the antenna and the photoconductive material (which acts as...
In this paper, a numerical method coupling moment method with circuit theory is used to analyze the influence of the grounding material's property on the performance of grounding grids. It can be seen that for a large grounding grid, when the soil resistivity is small, the influence of both resistivity and permeability of grounding material on the performance of grounding grids is great. If the frequency...
In this study, surface and electrical characteristics of carbon materials produced from organic waste were examined. First, used coffee grounds were carbonized and activated, and optimal times and temperatures of the carbonization-activation processing were examined, and Brunauer-Emmentt-Teller (BET) surface area, pore volume and pore size distributions were analyzed. Secondly, produced activated...
The electrical machines and in particular the electrical motors used in industrial applications are more and more often supplied by inverter drives, such as IGBT, so that the insulating organic materials of the inductor motor windings are subjected to voltage waveforms as PWM. In these conditions, degradation phenomena and in particular erosion due to partial discharges activity could take place,...
An influence of thermal and voltage treatments on properties of high-temperature electrical insulating material based on mica and silicone binder was analyzed. Tested material is intended for an operation at extremely high temperatures along with electric field stress. The main aim was to describe the high temperature and electric field influence on the material inner structure. Thermal treatment...
This paper presents a theoretical model for evaluating flashover performance of composite insulators under contaminated conditions. The model introduces several new features when compared with existing models such as, the formation of dry bands along the surface, variations in surface wettability and insulator shape. The model draws heavily from experimental measurements of flashover voltage and surface...
Adhesive joints formed of two types of electrically conductive adhesives have been aged at the higher temperature, higher humidity and a combination of the higher temperature/higher humidity. Correlations between these different types of aging have been calculated for joints resistances and joints nonlinearities. It has been found that correlations are high in the case of ECA #1 and low for ECA #2...
A 160 × 120 bolometer uncooled infrared read out circuit (ROIC) and detector equivalent model were presented. The SPICE simulation model was based on the relationship between micro-bolometer material thermal parameters and electrical parameters. Blind pixel compensation technique was used in the ROIC to suppress self-heating effect. As the main part of the ROIC, capacitive transimpedance amplifier...
To explore the effect of two different latent curing agents on the performance of anisotropic conductive adhesive (ACA), two adhesive with different latent curing agents (ACA1 and ACA2) were prepared and flexible radio frequency identification (RFID) tag inlays were assembled with them through flip chip technology. Curing profile and thermal stability of the pastes, microstructures and the bonding...
Quality of electrically conductive adhesives is a main component in electronic packaging. It highly influences the total quality of a product containing such a component. With time and usage, adhesives lose some of the qualities. In some cases, changes in the molecule structure for example, can be responsible for this influence on material characteristics. This process is known as aging. It can badly...
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