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As the trend for semiconductor packaging is heading towards BGA and flip chip interconnection methods, the conventional wire bonding process still dominates the industry primarily due the flexibility of wire bonds. The reliability of the bonded wires is assessed through wire bond shear test. In this study, the effects of shear ram speed on the stress response of bonded wires during wire bond shear...
The paper is devoted to comparative analysis of the structure and mechanical properties of leaded-tin bronze with lead inclusions of various morphologies. In order to obtain lead inclusions of certain morphology, casts are cooled at certain velocities. Low cooling velocities cause spheroidizing of lead inclusions, whereas high ones give prolate inclusions with torn uneven surface.
In this work results of a study of nanostructured metal sulfides obtained by self-propagating high-temperature synthesis from metal nanopowder and elementary sulphur are presented. The initial iron, copper, tungsten and molybdenum nanopowders were produced by electrical explosion of wires in argon at operating voltage 24–29 kV. Stoichiometric mixtures of metal nanopowders and sulphur were pressed...
The reliability of wire bond is very significant due to its function of providing interconnection and signal passage to the integrated circuit. Wire bond shear test are utilized to evaluate the reliability and bond strength of bonded wires. In this study, the wire bond shear test is simulated. The effects of shear tool height on the stress response of bonded wires are examined through simulation....
Atomistic coarse grained parameters were calculated from a non-equilibrium molecular dynamics simulation of the separation of an epoxy-copper interface. The methodology to determine the interaction energy and the equilibrium distance between the interfacial materials at a minimum energy is established. The traction-displacement relations of the separation under the influence of time taken for atomic...
As the market is desperate for better performed, miniaturized, highreliableand lower-priced electronic devices, nowadays, three dimensional integrated circuit (3D IC) seems to be a promising technology which can meet these requirements. However, many issues hinder this technology from being developedrapidly, among which the reliability of through silicon via(TSV) is one of the major concerns. Because...
The reliability of copper bonding wire in plastic mold package has been associated with the intermetallic compound formation and growth in the presence of halogen element such as chloride in epoxy molding compound. Much have been studied on copper aluminide intermetallic compounds at the copper/aluminium interface such as CuAl, CuAl2 and particularly Cu9Al4 which is known to link with failure in copper...
Copper nanoparticles are alternative for silver and gold nanoparticles which are currently used in inkjet printing of conductive patterns because of the low price and high electrical conductivity. However, the serious impediment to using copper nanoparticles for conductive inks is their spontaneous oxidation. In the paper, the well-dispersed antioxidative copper pastes were prepared by dispersing...
In analysis of copper wire moisture related reliability failures long hours are spent on the FIB tool. Two techniques are introduced to reduce the long analysis time: 1) An alternative FIB trenching method that reduces milling duration by 5X and, 2) A “FIB-free” approach using laser ablation
Hydrostatic stress of Cu damascene interconnects was calculated by using finite element method in the present work. The analytical work was performed to examine the distribution of hydrostatic stress and the effect of different line width in the Cu interconnects. Then a model of atomic diffusion was presented and used to calculate the size of stress-induced voiding according to result of hydrostatic...
The paper proposes an improved evaluation method for the calculation of the electric efficiency and power factor of the crucible induction furnaces. The method's advantage is the use of calculation expressions with per unit variables, without any direct dependence on the geometrical dimensions, which allow a quicker estimation of the energetic parameters based on the furnace capacity and physical...
Planar structures are often used in our days due to advantages like lower profile, lower leakage inductances and better thermal management. Although highly used components like power transformers, power inductors and EMI filters are built using this technique, planar structures must be improved because planar structure technology also has disadvantages like large footprint area, increased parasitic...
Herein we describe the annealing behavior of copper Through Silicon Vias (TSVs) in a series of experiments. Temperatures ranged from 150 °C to 450 °C and the dwell of the temperature varied between 30 min and 4 h. Copper protrusion, test samples warpage and the copper microstructure were examined in a subsequent characterization. Combining the results of these measurements enables the determination...
Reliable interconnection technology is key to the realization of reliable hybrid microelectronic systems that combine printed electronics and silicon technology. Flexible hybrid electronic systems-in-foil (SiF) that are typically suited for roll-to-roll (R2R) manufacturing place additional requirements and demands on interconnects. In this paper, three novel interconnection methodologies for SiF are...
Intensive FEA modeling was applied to the investigation of early solder joint failures of WLCSP mounted on test PCBs. In particular, stress in assembly reflow process was studied with 25 balls; 0.4 mm pitch WLCSP and PCBs with specially placed plated though vias. The 25 ball WLCSP in the study has 5×5 ball array, which corresponds to 16 outmost solder joints and nine inner solder joints, all soldered...
The further miniaturization of electronic devices brings the challenge to the electronic packaging, especially for 3D interconnection as the miscrostructure of the solder joint could be replaced by IMC fully without any solder bulk remain. In this paper, both FE modeling and experimental testing were applied to investigate the stress distribution and the fracture mode of the solder joint under tensile...
The paper presents power transformer design, using genetic algorithm (GA) and simulated annealing (SA) by minimizing total active cost, keeping in view the constraints imposed by international standards and power transformer specifications. The design results using conventional method (CM) have been compared with those obtained by applying GA and SA techniques and it is quite evident that the dimensions...
To help machine designers to design large permanent magnet (PM) machines to be more accurate, this paper presents a set of design considerations that are very often ignored by machine designers. These considerations are categorized into several aspects: electromagnetic (EM) performance, losses and efficiency, fault and stability, and some other issues. The effects of various practical factors are...
Developing 3D systems is a highly complex procedure. Next to a huge variation of possibilities on how to vertically integrate two or more dies, a lot of aspects regarding cost, design and application specific selection of technology have to be considered. Therefore a design model, considering the mutual influence of design and process technology during the integration flow development and a data management...
The formation and growth characteristics of intermetallic compounds (IMC) at the interfaces in nanoscale and microscale thickness Cu-Sn-Cu sandwich structure (with different solder layer thicknesses of 130nm, 400nm and 1.5µm) during reflow soldering and aging were studied. The sandwich structure samples were fabricated by electro-plating, and followed by reflow and aging process. It was found that...
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