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This paper presents an original concept of a 3D-PICS High density Integrated Passive Device Technology with P+ guard rings realized in a 300µm depth High Resistivity Silicon Substrate (HRS) in order to reduce significantly the substrate noise coupling. In this paper, a 3D-PICS IPD test chip was studied as the passive part prototype of a System-In-Package chip in combination with RF transceiver operating...
This paper proposes the use of Particle Swarm Optimization (PSO) to work with an Enhanced-ICP to effectively filter out outliers and avoid false matching points during the map building of an unknown environment, where PSO is used to solve the local optima problem to obtain better transformation results for two data sets with excessive difference in initial position and direction. Then, we use part...
With the technology nodes keep advancing, the application of TSV(Through Silicon Via) technology in 3D integration is faced with more challenges. The shift from via-last to via-middle fabrication scheme, the ever-increasing density of TSV, the reduction in supply voltage and the increase in frequency of on-chip local clock, all pose threat to signal/power integrity of the TSV system. In this paper,...
A potential technology by silicon interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-memory capacity. This paper presents a 2.5D-IC structure with silicon interposer to demonstrate electrical performances including...
Assessing the I/O performance delta between dual-referencing and ground-referencing schemes is needed to enable a lower layer count on either board or package, thereby reducing the overall platform cost. Existing methodologies attempted in quantifying impact simultaneously on both PI (Power Integrity) and SI (Signal Integrity) [1], [2] although the work is usually focused on I/O power delivery impact...
Memory bandwidth requirements for future high-end applications such as graphics, 200G/400G networking and high performance computing is driving the need for more “on-chip memory”. Silicon Interposer based 2.5D integration provides an intermediate path to achieving high memory bandwidth by integrating memory in package. This paper discusses timing budget analysis for realizing wide IO memory interfaces...
3D integration using a glass interposer and through glass via technologies is expected to improve the performance of a whole system significantly. However, due to the high quality factor of the glass substrate, the sharp impedance peaks on the Power Distribution Networks arise at the resonances. When the mode resonances occur, performance of a whole system could be degraded. Segmentation based impedance-estimation...
We propose a method to suppress the electrolyte potential noise in time-dependent protein sensing tests with an additional reference electrode, which doesn't have the challenging requirements as for the reference FET (REFET). The noise is recorded by the additional electrode and then suppressed in the sensing results. This noise is likely due to the electrochemical reaction at the electrolyte - solution...
For achieving a closed-loop, bidirectional control over myoelectric prosthetic hands, adopting the electrical stimulation in the sensory feedback channel for providing electrotactile substitution is currently a big trend. However, the electrical pulses used for stimulation may spread to the EMG collection sites which significantly interferes the controlling stability. In this paper, a novel noise...
Comprehensive studies on random telegraph signal (RTS) noise have been done to understand carrier trapping processes, with a main focus on the large variations of time constants. It is observed that time constant distributions, as well as thermal activation energy distributions, weakly depend on the substrate doping concentrations or surface orientations. For individual traps, time constants are quite...
The simulation of a double-tunnel junction with the SENS simulator gives access to the frequency-dependent and static behavior of shot noise. The concept of basic paths in a multi-state process provides a clear interpretation of the noise regimes, and allows locating cut-offs in autocorrelation functions and spectral densities.
This paper considers scheduled anti-windup design of linear systems in the presence of input saturation. We introduce the scheduled controller design method into the anticipatory anti-windup scheme. The proposed controllers are triggered depending on the response of the system, rather than only considering the worst noise case off-line, and then activating the anti-windup scheme before the physical...
It can be difficult to compare the merits of cameras using different sensor technologies using only the specifications typically provided by the manufacturers. The Noise Equivalent Irradiance (NEI) provides a normalized and unique parameter allowing a direct comparison. It is also fairly simple to calculate from the commercial specifications for a given wavelength and exposure time of interest. We...
The amplitude of the photoacoustic (PA) elastic bending signals vs. the modulation frequency of the excitation optical beam for the chip with Si cantilevers were measured and analyzed. The experimental PA elastic bending signals of the whole micromechanical structure were measured by using special constructed PA cell (the gas-microphone detection technique with transmission configuration). The PA...
This paper deals with comparisons of noise spectroscopy and I-V characteristic of semiconductor lasers diodes GaAs with InAs quantum dots layer. We studied two groups with different technologies (A and B). Each group had 4 samples. The samples were quality screened using noise analysis. From the measurement results it follows that the noise spectral density related to defects is of 1/f or and can...
We study the energy-efficient transmission problem for a time-varying interference channel. Assume that each source transmits in each time slot according to a transmission probability, which is a continuous value between 0 and 1. Our goal is to determine the values of the transmission probabilities and the transmission power levels so that the network energy efficiency is maximized. We show that the...
A potential technology by silicon interposer enables high bandwidth and low power application processing devices of the future, because the demand of smart mobile products are driving for higher logic-to-memory bandwidth (BW) over 30 GB/s with lower power consumption and ultra-memory capacity. This paper presents a 2.5D-IC structure with silicon interposer to demonstrate electrical performances including...
With the technology nodes keep advancing, the application of TSV(Through Silicon Via) technology in 3D integration is faced with more challenges. The shift from via-last to via-middle fabrication scheme, the ever-increasing density of TSV, the reduction in supply voltage and the increase in frequency of on-chip local clock, all pose threat to signal/power integrity of the TSV system. In this paper,...
The sensitivity of many experiments in the field of high-precision optical metrology is severely limited by coating thermal noise of the optical components, for example cavity mirrors. These components are commonly based on alternating layer pairs of amorphous materials. Particularly, for cryogenic applications highly reflective silicon gratings can be a promising low-noise alternative to these layer...
Thermal noise fundamentally limits the frequency stability of optical resonators used in optical clocks or to generate ultrapure microwaves by optical frequency division. We will give an overview of the relevant noise mechanisms, their calculation and discuss different current developments to reduce the noise. In one approach a cryogenic silicon resonator with very low thermal noise operated at a...
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